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ENGI 16 Layer FR4 High Density 2oz PCB Circuit Boards
ENGI 16 Layer FR4 High Density 2oz PCB Circuit Boards
ENGI 16 Layer FR4 High Density 2oz PCB Circuit Boards
ENGI 16 Layer FR4 High Density 2oz PCB Circuit Boards
Specifications
Brand Name :
ACCPCB
Model Number :
S1021341
Certification :
ISO,SGS,TS16949
Place of Origin :
China
MOQ :
1 PCS
Price :
Negotiable
Payment Terms :
T/T ,Western Union,Paypal
Supply Ability :
50000SQ.M/Per Month
Delivery Time :
3-5days
Packaging Details :
Vacuum packing
Material :
FR4
Count :
16layer
Surface Finish :
ENGI
Application :
Audio apparatus
Solder Mask :
Blue,Green,black, yellow etc.
Copper thickness :
2oz all layer
Min. hole size :
8 mil/6 mil
Min. line spacing :
4mil
Min. line width :
4mil
Service :
Customized PCB
Description

ENGI 16 Layer FR4 High Density 2oz PCB Circuit Boards

16Layer FR4 High Density PCB with ENGI and 1.20mm board thickness

Production description :

this board is 16layer with 2oz copper thickness. it is used for audio device. PCB prototype,samll volum, middle and large volume are accepted. no MOQ request for new order. all of these boards are met UL,TS16949, ISO9001 Etc.

Key Specifications of high frequency board :

Production Types:

Rigid HDI PCB

Layer :

16layer

Base Material :

FR4

Copper Thickness :

2oz

Board Thickness :

0.4mm

Min. Finish Hole Size :

8 mil (0.20mm)

Min. Line Width :

4 mil

Min. Line Spacing :

4 mil

Surface Finishing :

ENIG

Drilling hole tolerance:

+/-3 mil ( 0.075mm )

Min Outline tolerance :

+/-4 mil ( 0.10mm )

Working panel size :

max:1200mmX600mm (47'' X24'')

Outline profile:

Punching, Routing , CNC routing + V-cut

Solder mask :

LPI Solder mask, Peelable mask

Solder Mask Color :

Blue, black,yellow, matte green

Certificate :

UL, CQC, TS16949, ISO14000, ROHS

Silkscreen color :

White

Twist and Bow :

no more than 0.75 %

PCB Flow Chart.pdf

Products Application:

1, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;

2, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;

3, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;

4, Vehicle Electronices: Car etc;

5, Industrial controls: Medical device ,UPS equipment, Control device etc;

6, Military & Defense : Military Weapons etc;

Technology Capability:

Item Technical Parameters
Layers 1-28 Layers
Inner Layer Min Trace/Space 4/4 mil
Out Layer Min Trace,Space 4/4 mil
Inner Layer Max Copper 4 OZ
Out Layer Max Copper 4 OZ
Inner Layer Min Copper 1/3 oz
Out Layer Min Copper 1/3 oz
Min hole size 0.15 mm
Max.board thickness 6 mm
Min.board thickness 0.2mm
Max.board size 680*1200 mm
PTH Tolerance +/-0.075mm
NPTH Tolerance +/-0.05mm
Countersink Tolerance +/-0.15mm
Board Thickness Tolerance +/-10%
Min BGA 7mil
Min SMT 7*10 mil
Solder mask bridge 4 mil
Solder mask color White,black,blue,green,yellow,red,etc
Legend color White,black,yellow,gray,etc
Surface finish HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG
Board materials FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB
Impedance control +/-10%
Bow and twist ≤0.5


ENGI 16 Layer FR4 High Density 2oz PCB Circuit Boards

FAQ :
1. What kinds of boards can ACCPCB process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


2. What data are needed for PCB production?

PCB Gerber files with RS-274-X format.


3. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


4. How many types of surface finish ACCPCB can do?

the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

5. How do you make the impedance calculation?

The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.

Product tags

fr4 pcb specification

,

fr4 pcb specifications

,

fr4 substrate for boards
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ENGI 16 Layer FR4 High Density 2oz PCB Circuit Boards

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Product Detail
Brand Name :
ACCPCB
Model Number :
S1021341
Certification :
ISO,SGS,TS16949
Place of Origin :
China
MOQ :
1 PCS
Price :
Negotiable
Contact Supplier
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ENGI 16 Layer FR4 High Density 2oz PCB Circuit Boards
ENGI 16 Layer FR4 High Density 2oz PCB Circuit Boards

Accuracy Electronics Technologies Co.,Ltd

Active Member
6 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Exporter
Main Products :
Prototype PCB Board, LED Light PCB Board, HDI PCB Board
Total Annual :
3.1Million-4.7Million
Employee Number :
450~500
Certification Level :
Active Member
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