16 Layer 2oz Copper Multilayer PCB Board Immersion Gold Surface
Production description :
this board is 16layer. it is used on electronic register. PCB prototype,samll volum, middle and large volume are accepted. no MOQ request for new boards, for repeat order, just meet 3sq.m.
Key Specifications of tablet PCB board :
Production Types: | Rigid PCB |
Layer : | 16L |
Base Material : | KB FR4 TG150 |
Copper Thickness : | 2 oz |
Board Thickness : | 0.4mm |
Min. Finish Hole Size : | 8 mil (0.20mm) |
Min. Line Width : | 4 mil |
Min. Line Spacing : | 4 mil |
Surface Finishing : | ENIG,OSP,HASL,Immersion Gold,Gold Plating |
Drilling hole tolerance: | +/-3 mil ( 0.075mm ) |
Min Outline tolerance : | +/-4 mil ( 0.10mm ) |
Working panel size : | max:1200mmX600mm (47'' X24'') |
Outline profile: | Punching, Routing , CNC routing + V-cut |
Solder mask : | LPI Solder mask, Peelable mask |
Solder Mask Color : | Blue, black,yellow, matte green |
Certificate : | UL, CQC, TS16949, ISO14000, ROHS |
Silkscreen color : | White |
Twist and Bow : | no more than 0.75 % |
PCB Flow Chart.pdf
Products Application:
1, Telecom Communication
2, Consumer Electronics
3, Security monitor
4, Vehicle Electronices
5, Smart Home
6, Industrial controls
7, Military & Defense

Technology Capability:
Item | Technical Parameters |
Layers | 1-28 Layers |
Inner Layer Min Trace/Space | 4/4 mil |
Out Layer Min Trace,Space | 4/4 mil |
Inner Layer Max Copper | 4 OZ |
Out Layer Max Copper | 4 OZ |
Inner Layer Min Copper | 1/3 oz |
Out Layer Min Copper | 1/3 oz |
Min hole size | 0.15 mm |
Max.board thickness | 6 mm |
Min.board thickness | 0.2mm |
Max.board size | 680*1200 mm |
PTH Tolerance | +/-0.075mm |
NPTH Tolerance | +/-0.05mm |
Countersink Tolerance | +/-0.15mm |
Board Thickness Tolerance | +/-10% |
Min BGA | 7mil |
Min SMT | 7*10 mil |
Solder mask bridge | 4 mil |
Solder mask color | White,black,blue,green,yellow,red,etc |
Legend color | White,black,yellow,gray,etc |
Surface finish | HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG |
Board materials | FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB |
Impedance control | +/-10% |
Bow and twist | ≤0.5 |

FAQ :
1. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
4.How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process