High Density KB FR4 Tg170 10 Layer PCB 0.1mm 4mi Min Line Width
Production description :
customized PCB and used for electronic machines. PCB prototype,samll volum, middle and large volume are accepted. no MOQ request for new order. for repeat order, just meet 3sq.m.
Layer : | 10 Layers |
Base Material : | FR4 TG170 |
Copper Thickness : | 1.5 oz inner layer / 2oz outlayer |
Board Thickness : | 1.35 mm |
Min. Hole Size : | 6 mil, 0.15mm |
Min. Line Width : | 5 / 5 mil |
Min. Line Spacing : | 5 / 5mil |
Surface Finishing : | ENIG |
Working panel size : | max:1200mmX600mm (47'' X24'') |
Outline profile: | Punching, Routing , CNC routing + V-cut |
Solder mask : | LPI Solder mask, Peelable mask |
Solder Mask Color : | Blue, black,yellow, matte green |
Certificate : | UL, CQC, TS16949, ISO14000, ROHS |
Silkscreen color : | White |
Twist and Bow : | no more than 0.75 % |
Advantages :
• Strict product liability, taking IPC-A-160 standard
• Engineering pretreatment before production
• Production process control (5Ms)
• 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
• 100% AOI inspection, including X-ray, 3D microscope and ICT
• High-voltage test, impedance control test
• Micro section, soldering capacity, thermal stress test, shocking test
• In-house PCB production
• No minimum order quantity and free sample
• Focus on low to medium volume production
• Quick and on-time delivery
Technical Capability:
ITEMS | Capability |
Max. layer count | 28L |
Min. line widty | 0.08mm |
Min. line spacing | 0.08mm |
Min. hole size | 0.15mm |
Board thickness | 0.4-6.0mm |
Max. boardsize | 520×620mm |
(PTH) Hole size tolerance(PTH) | ±0.075mm |
(NPTH) Hole size tolerance(NPTH) ) | ±0.05mm |
Holeposition tolerance(Routing) | ±0.1mm |
Outline tolerance(Punching) | ±0.1mm |
FAQ
1. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
2. How many types of surface finish ACCPCB can do?
O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
6. What are the main factors which will affect the price of PCB?
Material;
Surface finish;
Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;
.