FR4 1.30mm PWB Board green board for laser marking Machines with ROHS Certification

Production description :

this board is 4 layer. it is use for machines. all of our PCB boards are met UL, TS 16949,ROHS, ISO Etc. certification. no MOQ request for new order.

Key Specifications/Special Features:

PCB Flow Chart.pdf

Here is our PCB order capability:

Layer : up to 20 layers

Materials : FR-4, FR4 High Tg/ High CTI Material

TG : 130-170

Surface : HASL LF , Immersion Gold/Silver/Tin, OSP, Gold Plated

Min drill size : 0.10mm

Min track/spacing : 4/4-mil

Buried and blind via : 0.2mm

CNC Milling and V-cut

Solder mask colors : Green, Blue, Black, White, Red and Yellow, Matte green, Matte black, Matte Blue

Silkscreen colors : black, white and yellow

Half Holes

Impedance control

Blue Peelable Mask

Carbon Treated

HDI available

Products Application:

1, Consumer Electronics

2, Telecom Communication
3, Vehicle Electronices
4, Security monitor
5, Industrial controls
6, Smart Home
7, Military & Defense

Shipping Information :

FOB Port : Hong Kong / Shenzhen

Lead Time : 6-10 days

HTS Code : 8534.00.10

Dimensions Per Carton : 37X27X22 cm

Weight Per Carton : 20 Kilograms

FAQ :

1. How do ACCPCB ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

3. What data are needed for PCB production?

PCB Gerber files with RS-274-X format.

4. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.

5. How many types of surface finish ACCPCB can do?

the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.