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Gold Plating 1 Oz Copper High Density Circuit Board With Blind Buried Vias
Gold Plating 1 Oz Copper High Density Circuit Board With Blind Buried Vias
Gold Plating 1 Oz Copper High Density Circuit Board With Blind Buried Vias
Gold Plating 1 Oz Copper High Density Circuit Board With Blind Buried Vias
Specifications
Brand Name :
ACCPCB
Model Number :
S1021336
Certification :
ISO,SGS,TS16949
Place of Origin :
China
MOQ :
1 PCS
Price :
Negotiable
Payment Terms :
T/T ,Western Union,Paypal
Supply Ability :
50000SQ.M/Per Month
Delivery Time :
3-5days
Packaging Details :
Vacuum packing
Material :
ITEQ FR4 tg180
Count :
8rigid layer
Surface Finish :
immersion gold
Application :
minitor equipment
Solder Mask :
green
Copper thickness :
1oz all layer
Min. hole size :
8 mil/6 mil
Min. line spacing :
4mil
Min. line width :
4mil
Service :
Customized PCB
Description

Gold Plating 1 Oz Copper High Density Circuit Board With Blind Buried Vias

1 Oz Copper High Density PCB with blind and buried vias 4mil Min Line Gold Plating

Production description :

this board is 8layer with 1oz copper thickness. it is used on monitor equipment. PCB prototype,samll volum, middle and large volume are accepted. no MOQ request for new order. all of these boards are met UL,TS16949, ISO9001 Etc.

Key Specifications of high frequency board :

Production Types:

Rigid communicated PCB

Layer :

8 layer

Base Material :

KB FR4 tg180

Copper Thickness :

1oz

Board Thickness :

1.50mm

Min. Finish Hole Size :

8 mil (0.20mm)

Min. Line Width :

4 mil

Min. Line Spacing :

4 mil

Surface Finishing :

Immersion gold

Drilling hole tolerance:

+/-3 mil ( 0.075mm )

Min Outline tolerance :

+/-4 mil ( 0.10mm )

Working panel size :

max:1200mmX600mm (47'' X24'')

Outline profile:

Punching, Routing , CNC routing + V-cut

Solder mask :

LPI Solder mask, Peelable mask

Solder Mask Color :

Blue, black,yellow, matte green

Certificate :

UL, CQC, TS16949, ISO14000, ROHS

Silkscreen color :

White

Twist and Bow :

no more than 0.75 %

PCB Flow Chart.pdf

Technology Capability:

Item

Technical Parameters

Layers

1-28 Layers

Inner Layer Min Trace/Space

4/4 mil

Out Layer Min Trace,Space

4/4 mil

Inner Layer Max Copper

4 OZ

Out Layer Max Copper

4 OZ

Inner Layer Min Copper

1/3 oz

Out Layer Min Copper

1/3 oz

Min hole size

0.15 mm

Max.board thickness

6 mm

Min.board thickness

0.2mm

Max.board size

680*1200 mm

PTH Tolerance

+/-0.075mm

NPTH Tolerance

+/-0.05mm

Countersink Tolerance

+/-0.15mm

Board Thickness Tolerance

+/-10%

Min BGA

7mil

Min SMT

7*10 mil

Solder mask bridge

4 mil

Solder mask color

White,black,blue,green,yellow,red,etc

Legend color

White,black,yellow,gray,etc

Surface finish

HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG

Board materials

FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB

Impedance control

+/-10%

Bow and twist

≤0.5

Products Application:

1, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;

2, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;

3, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;

4, Vehicle Electronices: Car etc;

5, Industrial controls: Medical device ,UPS equipment, Control device etc;

6, Military & Defense : Military Weapons etc;

Gold Plating 1 Oz Copper High Density Circuit Board With Blind Buried Vias

FAQ :


1. What kinds of boards can ACCPCB process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


2. What data are needed for PCB production?

PCB Gerber files with RS-274-X format.


3. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.



Product tags

led metal pcb

,

metal core pcb led

,

immersion silver finished pcb
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Gold Plating 1 Oz Copper High Density Circuit Board With Blind Buried Vias

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Product Detail
Brand Name :
ACCPCB
Model Number :
S1021336
Certification :
ISO,SGS,TS16949
Place of Origin :
China
MOQ :
1 PCS
Price :
Negotiable
Contact Supplier
video
Gold Plating 1 Oz Copper High Density Circuit Board With Blind Buried Vias
Gold Plating 1 Oz Copper High Density Circuit Board With Blind Buried Vias

Accuracy Electronics Technologies Co.,Ltd

Active Member
6 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Exporter
Main Products :
Prototype PCB Board, LED Light PCB Board, HDI PCB Board
Total Annual :
3.1Million-4.7Million
Employee Number :
450~500
Certification Level :
Active Member
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