Specifications
Brand Name :
ACCPCB
Model Number :
S1207
Certification :
ISO, UL, SGS,TS16949
Place of Origin :
China
MOQ :
1PCS
Price :
Negotiable
Payment Terms :
L/C / T/T / Western Union / Paypal
Delivery Time :
10-12days
Packaging Details :
Vacuum packing with desiccant
Product Name :
Multilayer Rigid boards
Thickness :
1.30mm
Size :
120mmX90mm
Min. line spacing :
0.1MM / 4MIL
Board thickness :
0.5~3.2mm
Surface finishing :
ENIG
Description

Nanya FR4 TG170 Material multi layer pcb fabrication with Black Soldermask for smartphone application

Key Specifications/Special Features:

Layer : 4 Layers
Base Material : FR4tg150
Copper Thickness : 1 / 1 /1 / 1 oz
Board Thickness : 1.20mm
Min. Hole Size : 6 mil, 0.15mm
Min. Line Width : 4/4 mil, 0.075/0.075 mm
Min. Line Spacing : 4/4mil, 0.075/0.075 mm
Surface Finishing : ENIG
Cooper thickness in holes: 0.020-0.035mm
Solder mask: LPI solder mask , peelable mask
Outline profile: punching, CNC routing
outline tolerance: 0.127mm
twist and bow: 0.5-0.75%
impedance control: +/-10%
Aspect Ratio: 10:1(max)

PCB Flow Chart.pdf

Advantages :
• Strict product liability, taking IPC-A-160 standard
• Engineering pretreatment before production
• Production process control (5Ms)
• 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
• 100% AOI inspection, including X-ray, 3D microscope and ICT
• High-voltage test, impedance control test
• Micro section, soldering capacity, thermal stress test, shocking test
• In-house PCB production
• No minimum order quantity and free sample
• Focus on low to medium volume production
• Quick and on-time delivery

Technical Capability:

ITEMS Capability
Max. layer count 28L
Min. line widty 0.08mm
Min. line spacing 0.08mm
Min. hole size 0.15mm
Board thickness 0.4-6.0mm
Max. boardsize 520×620mm
(PTH) Hole size tolerance(PTH) ±0.075mm
(NPTH) Hole size tolerance(NPTH) ) ±0.05mm
Holeposition tolerance(Routing) ±0.1mm
Outline tolerance(Punching) ±0.1mm

Nanya FR4 TG170 Material Multi Layer Pcb Fabrication Black Soldermask For Smartphone

FAQ:
1. What kinds of boards can ACCPCB process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


2. What data are needed for PCB production?

PCB Gerber files with RS-274-X format.


3. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


4. How many types of surface finish ACCPCB can do?

the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

5. How do ACCPCB ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

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Nanya FR4 TG170 Material Multi Layer Pcb Fabrication Black Soldermask For Smartphone

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Brand Name :
ACCPCB
Model Number :
S1207
Certification :
ISO, UL, SGS,TS16949
Place of Origin :
China
MOQ :
1PCS
Price :
Negotiable
Contact Supplier
video
Nanya FR4 TG170 Material Multi Layer Pcb Fabrication Black Soldermask For Smartphone
Nanya FR4 TG170 Material Multi Layer Pcb Fabrication Black Soldermask For Smartphone

Accuracy Electronics Technologies Co.,Ltd

Active Member
6 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Exporter
Total Annual :
3.1Million-4.7Million
Employee Number :
450~500
Certification Level :
Active Member
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