High‑Dependability Copper‑Polyimide Composite Suited for Dynamic Bending Conditions
Product Overview:
The GL‑grade product line establishes a new performance benchmark for polyimide films. Our in‑house manufacturing process delivers substantially optimized molecular structures, delivering over 30‑percent improvements in key metrics including tensile strength, dimensional stability and chemical resistance versus standard‑grade alternatives. Boasting high‑performance characteristics, this native‑yellow polyimide film supports customizable thickness specifications. It serves as an indispensable raw material for high‑stake scenarios, ranging from high‑reliability adhesive‑bonded substrates to sophisticated chip‑packaging solutions.
Place of Origin:
ANHUI, CHINA
Treatment:
Single-side / Both Sides
Width:
514MM, 520MM, 1028MM, 1040MM
Packaging:
vacuum packaging
Supply Ability:
2000 ton/year
Superior Mechanical Robustness
Excellent Dimensional Consistency
Premium Lamination Performance
Compliant with RoHS and REACH regulatory requirements
High‑density flexible copper clad laminates (FCCL) for FPC fabrication
Dimensionally stable coverlays for circuit protection
Advanced encapsulation and packaging for semiconductor devices
High‑performance substrates for specialty adhesive tapes
In order to retain full integrity and performance of our polyimide film, kindly comply with these storage recommendations:
Shelf Life: 6 months upon production date.
Preferred Environment: Store within cool, dry premises with consistent ambient parameters.
Precautions: Retain factory‑sealed original packaging. Shield the material against direct sunlight, dampness and extreme thermal conditions.
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