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Opaque Black Thermosetting PI Heating Substrate Designed for High Heat Insulation Applications
Opaque Black Thermosetting PI Heating Substrate Designed for High Heat Insulation Applications
Opaque Black Thermosetting PI Heating Substrate Designed for High Heat Insulation Applications
Opaque Black Thermosetting PI Heating Substrate Designed for High Heat Insulation Applications
Specifications
Model Number :
GB
Width :
12mm
Price :
$300-$30000
Tensile Strength :
135 N/25mm
Supply Ability :
Negotiation
Chemical Resistance :
Excellent
Application :
Electrical insulation, PCB masking, high temperature masking
Payment Terms :
L/C,T/T
Temperature Resistance :
Up to 260°C
Length :
negotiation
MOQ :
Negotiation
Delivery Time :
Negotiation
Adhesive Type :
Silicone
Place of Origin :
China
Dielectric Strength :
5.5 kV/mm
Packaging Details :
Barrier+ PE foam sheet+ PE film+ Foam packing cotton
Uv Resistance :
Yes
Certification :
UL ISO ROHS
Brand Name :
Guofeng
Color :
Amber
Description


Opaque Black Thermosetting PI Heating Substrate Designed for High Heat Insulation Applications
GB Series Black Polyimide Substrate integrates exceptional thermal stability, superior dielectric insulation and reliable dimensional consistency all in one material. This opaque black film is widely applied across electronic components, flexible printed circuits and semiconductor packaging sectors. It maintains premium overall performance and fulfills strict light-shielding requirements at the same time.
Key Specifications
Place of Origin ANHUI, CHINA
Certification UL ISO ROHS
Material Polyimide
Color Yellow
Treatment Single-side / Both Sides
Width 514MM 520MM 1028MM 1040MM
Thickness 12.5μm 20μm 18μm 25μm
Packing Style Standard Packing
Roll Length Customized
Packaging Details Wooden pallet
Supply Ability 2000 ton/year


Product Advantages


Superior mechanical performance and thermal endurance

Ultra-low thermal expansion coefficient

Premium adhesive lamination performance

Fully compliant with RoHS & REACH standards

Certified to UL safety specifications

Applications
This high-performance GL polyimide film is utilized in:
  • High-precision adhesive flexible copper clad laminate (FCCL) substrates
  • High-stability protective overlay
  • Semiconductor packaging
  • Specialized pressure-sensitive tape carriers
Why Choose Our Factory?
  • Direct Manufacturer Pricing: Competitive costs, flexible MOQs, and fast delivery
  • Technical Expertise: Customized anti-fog testing and packaging optimization support
Available in custom thicknesses, widths, and finishes (matte, glossy, metallic), our Polyimide film ensures consistent quality, fast production, and competitive pricing for bulk orders. Contact us today for free samples & wholesale deals!
Handling & Storage Instructions
To ensure the longevity and performance of our Polyimide film:
  • Shelf Life: 6 months from the date of manufacture
  • Storage Conditions:
    • Store in a cool, dry place away from direct sunlight
    • Avoid exposure to high humidity or extreme temperature fluctuations
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Opaque Black Thermosetting PI Heating Substrate Designed for High Heat Insulation Applications

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Product Detail
Model Number :
GB
Width :
12mm
Price :
$300-$30000
Tensile Strength :
135 N/25mm
Supply Ability :
Negotiation
Chemical Resistance :
Excellent
Contact Supplier
Opaque Black Thermosetting PI Heating Substrate Designed for High Heat Insulation Applications
Opaque Black Thermosetting PI Heating Substrate Designed for High Heat Insulation Applications

Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.

Verified Supplier
2 Years
hefei
Since 2021
Business Type :
Manufacturer
Main Products :
PI Material, Polyimide PI Film, Polyimide Thin Film
Total Annual :
28000-50000
Employee Number :
300~400
Certification Level :
Verified Supplier
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