Scr Thyristor High Current Power Semiconductors Electronic Components
Main Features of the Semiconductors Electronic Components:
* Electrically-isolated chip and baseboard AC 2500V
* Sealing package according to international standard
* Full crimping structure, sensitive to temperature and power cycle duty
* Modules under350Awith compulsive wind-cooling. Modules under 400A either with wind-cooling or water-cooling
* Convenient installation, use and maintenance
* Compact and lightweight
* Welding technique under the protection of vacuum and hydrogen gas
| Type | IT(AV) | VRRM | dV/dt | di/dt | IDRM IRRM | IGT | VGT | IH | VTM/ITM | Tjm | Outline |
| | | A | A/ μ s | mA | mA | V | mA | V/A | ℃ | |
| MD200A | 200 | 800~1600 | | | 20 | | | | 1.6/600 | 125 | 100B |
| MD300A | 300 | 800~1600 | | | 25 | | | | 1.6/900 | 125 | 100B |
| MD500A | 500 | 800~1600 | | | 30 | | | | 1.6/1500 | 125 | 106B |

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