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SMT solder paste centrifugal mixing and degassing machine
SMT solder paste centrifugal mixing and degassing machine
SMT solder paste centrifugal mixing and degassing machine
SMT solder paste centrifugal mixing and degassing machine
SMT solder paste centrifugal mixing and degassing machine
SMT solder paste centrifugal mixing and degassing machine
SMT solder paste centrifugal mixing and degassing machine
SMT solder paste centrifugal mixing and degassing machine
SMT solder paste centrifugal mixing and degassing machine
SMT solder paste centrifugal mixing and degassing machine
SMT solder paste centrifugal mixing and degassing machine
SMT solder paste centrifugal mixing and degassing machine
Specifications
Display :
LCD digital with data export
Certification :
ISO 9001
Temperature Range :
Ambient to 250 degree C
Test Functions :
Viscosity Slump Tack Solder Ball
Payment Terms :
T/T
Sample Size :
Standard 500g jar compatible
Dimensions :
350×300×200mm
Price :
open to negotiation
Supply Ability :
500 Sets per Month
Place of Origin :
Guangdong, China
Power Supply :
AC 110V/220V 50/60Hz
Model Number :
OK-XGJBJ
MOQ :
1 Set
Packaging Details :
Standard export carton with foam insert, calibrated test fixtures included, double-wall corrugated packaging
Delivery Time :
3-7 working days
Test Standards :
IPC-TM-650 JIS Z 3284
Machine Model :
OK-QC500
Brand Name :
Okai Intelligent Technology Co., Ltd.
Description

OK-QC500 Solder Paste Aging Inspection Tester

The OK-QC500 is a dedicated solder paste quality control tester for verifying that aged and rewarmed solder paste meets printing specifications before entering production. It performs the four critical IPC-TM-650 standard tests — viscosity, slump, tack, and solder ball — providing lab-grade quality assurance in a compact benchtop instrument.

Key Features

  • Viscosity Test: Measures paste viscosity after rewarming against manufacturer specifications to verify proper flow characteristics for stencil printing
  • Slump Test: Evaluates paste shape retention after printing — cold or over-aged paste that spreads laterally will be detected before causing bridging defects
  • Tack Test: Quantifies paste tackiness to ensure adequate component hold force during placement and transport before reflow
  • Solder Ball Test: Identifies paste degradation by checking for excessive solder ball formation during reflow — a key indicator of expired or improperly stored paste
  • IPC-TM-650 and JIS Z 3284 Compliant: Test protocols aligned with international industry standards for auditable quality records

Applications

Essential for SMT quality labs, incoming inspection departments, and production lines running fine-pitch assembly where paste quality directly impacts first-pass yield. Recommended for facilities using refrigerated paste storage and FIFO inventory management.

Packaging and Shipping

Compact benchtop instrument with standard export packaging. Includes calibrated test fixtures and protocol documentation. Delivery in 3-7 working days.

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SMT solder paste centrifugal mixing and degassing machine

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Product Detail
Display :
LCD digital with data export
Certification :
ISO 9001
Temperature Range :
Ambient to 250 degree C
Test Functions :
Viscosity Slump Tack Solder Ball
Payment Terms :
T/T
Sample Size :
Standard 500g jar compatible
Contact Supplier
video
SMT solder paste centrifugal mixing and degassing machine
SMT solder paste centrifugal mixing and degassing machine
SMT solder paste centrifugal mixing and degassing machine
SMT solder paste centrifugal mixing and degassing machine
SMT solder paste centrifugal mixing and degassing machine
SMT solder paste centrifugal mixing and degassing machine

Guangdong Okai Intelligent Technology Co., Ltd.

Verified Supplier
1 Years
guangdong, dongguan
Since 2008
Business Type :
Manufacturer, Exporter
Main Products :
PCB Loader Unloader, SMT PCB Conveyor, SMT Solder Paste Printer
Total Annual :
10000000-20000000
Employee Number :
90~150
Certification Level :
Verified Supplier
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