Single-rail NGOK buffer machine for SMT PCB depaneling and buffering

I. Equipment Parameters
Model: OK-HCJ-460 Single-rail buffer machine
Dimensions: 600*1080*1600mm
Conveying height: 900±30mm (suitable for standard SMT production lines)
Compatible PCB specifications: Board width 50-460mm, maximum board length 450mm
Power supply: 220V Power: 0.35KW
Conveying Direction: Freely switchable left and right
Buffer Capacity: 20 PCB boards per batch
Working Air Pressure: 4-6 bar
Total Weight: 200KG
Conveying Track: Single-rail design

II. Equipment Features
Single-rail design, compact footprint, suitable for small and medium-sized SMT production line layouts
Integrated enclosed sheet metal + aluminum alloy body, sturdy and durable, strong safety protection, dustproof and impact-resistant in the workshop
Automatic NG/OK board sorting buffer + pass-through mode in one unit, one machine meets multiple production needs
Original PLC stable control system, smooth operation, low failure rate, stable operation in long-term mass production
Supports first-in-first-out/last-in-first-out Dual-mode operation for more standardized material control. High-definition touchscreen control with built-in automatic fault diagnosis and clear alarm prompts, allowing even beginners to quickly get started. Adjustable lifting step distance according to PCB thickness, compatible with various PCB thicknesses. Hand-cranked screw width adjustment structure for smooth and precise adjustment, ensuring accurate alignment. Dual alarm reminders (audio-visual + screen) provide timely warnings of abnormalities, reducing production losses. Standard universal communication interface allows seamless integration with various automated equipment in SMT production lines.

III. Advantages:

Robust and compact structure for flexible installation and placement; simple operation requiring no complex debugging; convenient maintenance; precise board separation buffer to prevent board mixing, perfectly solving production line bottlenecks and improving overall production line efficiency.

: SMT assembly line:

Used in conjunction with pick-and-place machines and reflow soldering back-end systems to provide temporary buffering for soldered PCBs, balancing the production speed difference between upstream and downstream equipment and preventing line blockages and idle runs.

Optical Inspection Backend Support: Adapts to SPI solder paste inspection and AOI visual inspection equipment, automatically receiving inspection signals and distinguishing between defective and qualified boards, achieving automatic separation and storage of good and bad boards without manual sorting.

Semiconductor Packaging Process: Can be used as a material transfer buffer between chip photolithography, etching, and packaging processes, ensuring smooth and uninterrupted connection between each production step.

This equipment handles board movement, flipping, or buffering within automated SMT lines. It helps reduce the number of times an operator needs to touch a board, which lowers the risk of damage and keeps cycle times predictable.