Our SiC end effectors are designed for ultra-clean wafer handling in semiconductor manufacturing environments. Manufactured using high-purity silicon carbide, these forks provide exceptional thermal resistance, chemical stability, and mechanical strength—making them ideal for use in harsh process chambers such as etching, deposition, and high-temperature transport systems.
The dense, fine-grain SiC body ensures low particle generation, excellent dimensional stability, and compatibility with 200mm to 300mm wafers. Custom designs are available for specific robotic arms and wafer carriers.
Parameter | Specification |
---|---|
Material | High-purity SiC (≥99%) |
Size | Customizable (for 4–12 inch wafers) |
Surface Finish | Polished or matte per requirement |
Thermal Resistance | Up to 1600°C |
Chemical Resistance | Resistant to acids, bases, and plasma |
Mechanical Strength | Flexural strength > 400 MPa |
Cleanroom Grade | Suitable for Class 1–100 |
#SiCEndEffector #WaferHandling #SiCFork #SemiconductorEquipment #WaferTransfer #HighPuritySiC #SiCWaferCarrier #SemiconductorAutomation #VacuumCompatible #SiCComponent #EtchingToolPart #RoboticWaferHandling