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3Inch Optical Grade Quartz Wafer Transmittance >92% Semiconductor Glass Substrates​​

ZMSH specializes in ​​custom-manufactured 3-inch quartz wafers​​, offering tailored solutions for advanced optoelectronic, MEMS, and semiconductor applications. Unlike standard 2-inch wafers, 3-inch quartz wafers provide expanded surface area for multi-component integration, enabling high-precision devices with enhanced performance. Key features include: ​​

· Material​​: High-purity fused silica (SiO₂) with <50 ppm hydroxyl content, ensuring ultra-low optical loss.

· Dimensions​​: Custom diameters (3.00" ±0.02") and thicknesses (0.525–1.200 mm, TTV ≤10 μm). ​​

· Shapes​​: Circular, square, or irregular geometries with non-standard apertures, stepped edges, or gradient thickness. ​​

· Surface Finish​​: Ultra-smooth surfaces (Ra ≤1.0 nm) for minimal light scattering.

Specification for 3inch quartz wafer

​​Key Characteristics​​ of 3inch quartz wafer

​​1. Optical Superiority​​

​​- Broad Spectral Transmission​​: >92% transmittance from 185 nm (UV) to 3500 nm (IR), ideal for UV lithography and quantum sensing .

- ​​Low Thermal Expansion​​: CTE of 0.52×10⁻⁶/°C, maintaining dimensional stability up to 1100°C.

2. ​​Mechanical & Chemical Resilience​​

- ​​High Hardness​​: Mohs scale 7, resistant to abrasion and mechanical shock.

- ​​Acid Resistance​​: 30× higher durability than ceramics, suitable for aggressive chemical environments .

3. ​​Electrical Performance​​

- ​​Insulation​​: Resistivity >10¹⁸ Ω·cm, minimizing parasitic capacitance in high-frequency circuits.

​​- SAW Compatibility​​: Optimized for Surface Acoustic Wave (SAW) filters with precise cutting angles (e.g., 34.33° for FC-cut) .

​​Strategic Applications​ of 3inch quartz wafer

​​1. Advanced MEMS Devices​​

- Pressure sensors, gyroscopes, and inkjet printheads leveraging 3-inch wafers for multi-layer integration and thermal stability.

2. ​​Optoelectronic Systems​​

- UV laser diodes, fiber-optic collimators, and LiDAR components requiring low-loss optical paths.

​​3. Semiconductor Packaging​​

- Wafer-level packaging (WLP) substrates for CMOS image sensors and RFICs, supporting TSV (Through-Silicon Via) technology.

4. ​​Quantum Technologies​​

- Substrates for diamond nitrogen-vacancy (NV) centers and superconducting qubits, benefiting from ultra-low defect density.

Quartz Capillary Tubes: Brief Overview​

ZMSH's quartz capillaries are engineered for microfluidic and optical applications, featuring:

- ​​Custom Sizes​​: Inner diameters from 50 μm to 5 mm, lengths up to 300 mm. ​​

- Ultra-High Purity​​: <1 ppm metallic impurities for biocompatibility in lab-on-a-chip systems. ​​

- Processing​​: Laser drilling, thermal forming, and chemical etching for seamless integration into sensors or optical fibers.