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​​CMP Grinding Plate​​ ​​Chemical Mechanical Polishing of Wafers​​
​​CMP Grinding Plate​​ ​​Chemical Mechanical Polishing of Wafers​​
​​CMP Grinding Plate​​ ​​Chemical Mechanical Polishing of Wafers​​
​​CMP Grinding Plate​​ ​​Chemical Mechanical Polishing of Wafers​​
​​CMP Grinding Plate​​ ​​Chemical Mechanical Polishing of Wafers​​
​​CMP Grinding Plate​​ ​​Chemical Mechanical Polishing of Wafers​​
Specifications
Brand Name :
ZMSH
Model Number :
CMP Polishing Platen​​
Certification :
rohs
Place of Origin :
CHINA
MOQ :
5
Price :
by case
Payment Terms :
T/T
Delivery Time :
2-4 weeks
Packaging Details :
package in 100-grade cleaning room
Diameter​​ :
95mm–600mm
Diamond Grit Size​​ :
74μm–251μm
Base Material​​ :
Stainless Steel, Ceramic, Polymer
Conditioning Life​​ :
Up to hundreds of hours
Flatness​​ :
≤ 0.5μm
Applications :
Semiconductor Manufacturing, ​​Precision Optics​​
Description

​​CMP Grinding Plate Overview​

​​CMP Grinding Plate​​ ​​Chemical Mechanical Polishing of Wafers​​

​​​​CMP Grinding Plates are ​​core consumables​​ in the Chemical Mechanical Polishing (CMP) process. They are primarily used to ​​condition and activate the polishing pad surface​​, maintaining a stable polishing rate, achieving ​​wafer-scale nanoscale planarization​​, and directly impacting the ​​yield, cost, and productivity​​ of semiconductor manufacturing.

​​CMP Grinding Plate​​s interact with the polishing pad surface through ​​mechanical conditioning​​, removing polishing by-products and glazed layers, restoring the pad's roughness and porosity. This ensures uniform distribution of polishing slurry and a consistent Material Removal Rate (MRR). They are indispensable key components in advanced semiconductor processes (e.g., copper interconnects, silicon vias, STI) .

​​CMP Grinding Plate Core Functions​

1.​Conditioning Polishing Pad Surface​​: Removes ​​glazed layers and clogging materials​​ from the pad surface, restoring its roughness and open-cell structure to maintain a stable polishing rate.

2.​Controlling Polishing Uniformity​​: Ensures ​​consistent morphology​​ of the pad surface through precise conditioning actions, preventing non-uniform polishing (e.g., dishing, erosion) on the wafer surface.

3.​Extending Polishing Pad Life​​: Regular conditioning ​​reduces the frequency of pad replacement​​, lowering production costs.

4.​​Reducing Defects​​: Optimizing conditioning parameters (e.g., pressure, rotational speed) ​​minimizes the risk of scratches, particle contamination, and metal residue​​ on the wafer surface.


​​CMP Grinding Plate​​ ​​Chemical Mechanical Polishing of Wafers​​​​CMP Grinding Plate​​ ​​Chemical Mechanical Polishing of Wafers​​

​​CMP Grinding Plate Technical Features​

​​Feature Category​​ ​​Specific Characteristics​​ ​​Value Proposition​​
​​Material Innovation​​

Employs ​​CVD diamond coatings​​, ​​sintered abrasive technology​​ (e.g., 3M Trizact™ series), or ​​ceramic composites​​ (e.g., high-purity alumina)

 Achieves ​​ultra-high hardness (Mohs 9+)​​, ​​high wear resistance​​, and ​​long service life​​
​​Structural Design​​

​​Micro-replicated surface textures​​ (e.g., 3M Trizact™), ​​precise diamond placement​​ (e.g., C-series), ​​porous structures​​, or ​​custom geometries​​ (e.g., bar, disc)

 Provides ​​consistent conditioning performance​​, ​​excellent slurry distribution​​, and ​​lower defect rates​​
​​Performance Advantages​​

​​Metal-free contamination​​ (coatings can reduce metal leaching by 75%), ​​low coefficient of thermal expansion​​, ​​high chemical stability​​, and ​​adjustable stiffness​​

 Meets ​​advanced node​​ stringent requirements for purity, thermal stability, and process consistency
​​Customization Capability​​

Supports ​​diameter customization​​ (e.g., 95mm to 600mm), ​​diamond grit selection​​ (e.g., 74μm to 251μm), and ​​base material adaptation​​ (stainless steel, ceramic polymer)

 Adapts to different CMP equipment (rotary, orbital) and process needs (Cu, W, Si polishing)

CMP Grinding Plate Types and Applications​

​​CMP Grinding Plate​​ ​​Chemical Mechanical Polishing of Wafers​​

1.​Diamond Conditioning Disks​​:

  • ​​Features​​: Use ​​CVD diamond​​ or ​​electroplated diamond​​ as abrasives, fixed to a stainless steel or ceramic base via sintering, offering ​​extremely high conditioning efficiency and service life​​.
  • ​​Application​​: Primarily used in CMP processes for ​​high-end logic and memory chip​​ manufacturing, such as copper barrier layers (Barrier Cu) and Shallow Trench Isolation (STI).

2.​Metal-Free Conditioning Brushes​​:

  • ​Features​​: Use ​​polymer or ceramic fiber bristles​​, are ​​metal-free​​, avoid ionic contamination, and are suitable for ​​metal-sensitive processes​​.
  • ​​Application​​: Often used for ​​post-CMP cleaning​​ of polishing pads and ​​light conditioning​​.

​​CMP Grinding Plate​​ ​​Chemical Mechanical Polishing of Wafers​​​​CMP Grinding Plate​​ ​​Chemical Mechanical Polishing of Wafers​​

3.​Composite Conditioning Disks​​:

  • ​​Features​​: Combine the ​​conditioning power of diamond disks​​ and the ​​low-defect characteristics of soft brushes​​, optimizing defect rates through adjustable hardness and bristle shape.
  • ​​Application​​: Suitable for complex processes involving ​​multiple material polishing​​, such as ​​advanced packaging and 3D integration​​.

CMP Grinding Plate Key Performance Parameters​​

​​Parameter Name​​

​​Typical Value/Range​​

​​Significance​​

​​Diameter​​

95mm–600mm

Adapts the disk size to different CMP equipment

​​Diamond Grit Size​​

74μm–251μm

Influences conditioning aggressiveness and surface roughness

​​Base Material​​

Stainless Steel, Ceramic, Polymer

Determines rigidity, corrosion resistance, and applicable processes

​​Conditioning Life​​

Up to hundreds of hours

Directly impacts consumable cost and equipment downtime

​​Flatness​​

≤ 0.5μm

Ensures conditioning uniformity and wafer planarization results

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​​CMP Grinding Plate​​ ​​Chemical Mechanical Polishing of Wafers​​

2. Customized SiC Ceramic Boat Carrier For Wafer Handling

​​CMP Grinding Plate​​ ​​Chemical Mechanical Polishing of Wafers​​

CMP Grinding Plate FAQ

Q1: What is the main purpose of a CMP grinding plate (conditioner disk)?​​

​​A1:​​ Its primary function is to ​​resurface and activate the polishing pad​​ by removing glazed layers and debris, ensuring consistent polishing rates and achieving global nanoscale planarization of wafers during chemical mechanical polishing (CMP).

​​Q2: Why choose a silicon carbide (SiC) diamond grinding plate for CMP?​​

​​A2:​​ Silicon carbide diamond grinding plates offer ​​exceptional hardness (Mohs 9+), high wear resistance, thermal stability, and chemical inertness​​, making them ideal for maintaining pad roughness and extending service life in demanding semiconductor CMP processes.


Tags: #​​CMP Grinding Plate​​, #Customized, #Chemical Mechanical Polishing of Wafers​​

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​​CMP Grinding Plate​​ ​​Chemical Mechanical Polishing of Wafers​​

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Product Detail
Brand Name :
ZMSH
Model Number :
CMP Polishing Platen​​
Certification :
rohs
Place of Origin :
CHINA
MOQ :
5
Price :
by case
Contact Supplier
​​CMP Grinding Plate​​ ​​Chemical Mechanical Polishing of Wafers​​
​​CMP Grinding Plate​​ ​​Chemical Mechanical Polishing of Wafers​​
​​CMP Grinding Plate​​ ​​Chemical Mechanical Polishing of Wafers​​

SHANGHAI FAMOUS TRADE CO.,LTD

Verified Supplier
8 Years
shanghai, shanghai
Since 2013
Business Type :
Manufacturer, Agent, Importer, Exporter, Trading Company
Main Products :
Gallium Nitride Wafer, Sapphire Wafer, SiC Substrate
Total Annual :
1000000-1500000
Certification Level :
Verified Supplier
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