Single Sided Half Hole Custom PCB Circuit Board For ATM System
 
 
Quick detail:
 
| Brand: XCE | 
| Model: XCEC | 
| Layer: 2 | 
| Board thickness: 0.2mm | 
| Copper THK: 0.5oz | 
| Min line space and width: 2mil | 
| BGA: YES | 
| Base material: rogers | 
Our pruducts:
 
our products have passed UL, ISO9001 and IS014001 certifications.
NO  | ITEM  | Technical capabilities  | 
1  | Layers  | 1-30 layers  | 
2  | Max. Board size  | 2000×610mm  | 
3  | Min. board Thickness  | 2-layer 0.15mm  | 
4-layer 0.38mm  | ||
6-layer 0.55mm  | ||
8-layer 0.80mm  | ||
10-layer 1.0mm  | ||
4  | Min. line Width/Space  | 0.075mm(3mil)  | 
5  | Max. Copper thickness  | 6OZ  | 
6  | Min. S/M Pitch  | 0.075mm(3mil)  | 
7  | Min. hole size  | 0.1mm(4mil)  | 
8  | Hole dia. Tolerance (PTH)  | ±0.05mm(2mil)  | 
9  | Hole dia. Tolerance (NPTH)  | +0/-0.05mm(2mil)  | 
10  | Hole position deviation  | ±0.05mm(2mil)  | 
11  | Outline tolerance  | ±0.10mm(4mil)  | 
12  | Twist & Bent  | 0.75%  | 
13  | Insulation Resistance  | >1012Ω Normal  | 
14  | Electric strength  | >1.3kv/mm  | 
15  | S/M abrasion  | >6H  | 
16  | Thermal stress  | 288°C 20Sec  | 
17  | Test Voltage  | 50-300V  | 
18  | Min. blind/buried via  | 0.15mm (6mil)  | 
19  | Surface Finished  | HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold  | 
20  | Materials  | FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base  | 
 
 