Printed Circuit Board Multilayer PCB FR4 Material Custom-Made Service
Specification:
Model: XCEM
Origin: China
Min line space: 10mil
Min line width: 10 mil
 Board size: 16*6 cm
Layer: 8
Board thickness: 1.2mm
Copper foil: 35UM
Material: FR4
Our Quality:
We are committed to providing the HIGHEST QUALITY PCBs that not only meet but exceed our customers’ expectations and requirements. Our facilities hold a list of quality certifications (IS9001, TS16949, UL) and the systems to support them. For quality control purposes, we have invested extensively in inspection machinery, including:
    High-voltage E-test
     Flying probe machine
     Digital computer metallographic microscope
     Copper thickness tester
     Solderability detecting machine
     Photoelectricity balance
     X-ray gold thickness tester
     Backlighting tester
     Automatic optical inspector
Parameter:
|  			 Technology  |  			 			 Capabilities  |  			 			 Capabilities  |  		
|  			 Max.Layer Count  |  			 			 30 Layers  |  			 			 30 Layers  |  		
|  			 Max.Panel Size  |  			 			 27.5"x24"  |  			 			 27.5"x24"  |  		
|  			 Max.Board Thickness  |  			 			 3.5mm  |  			 			 5.8mm  |  		
|  			 Outer Layer  |  			 			 3.5/3.5mils  |  			 			 3/3mils  |  		
|  			 Inner Layer  |  			 			 3.5/3.5mils  |  			 			 3/3mils  |  		
|  			 Min.Board Thickness  |  			 			 2L:6mils  |  			 			 2L:6mils  |  		
|  			 
  |  			 			 4L:15mils  |  			 			 4L:15mils  |  		
|  			 
  |  			 			 6L:23mils  |  			 			 6L:23mils  |  		
|  			 Min.SMT/BGA Pitch  |  			 			 12mils for SMT  |  			 			 12mils for SMT  |  		
|  			 
  |  			 			 24mils for BGA  |  			 			 20mils for BGA  |  		
|  			 Min.Drill Size&Aspect Ratio  |  			 			 0.2mm Drill for 0.8mm Thickness(4.0:1)  |  			 			   0.2mm Drill for 0.8mm  |  		
|  			 
  |  			 			   0.25mm Drill for 1.6mm  |  			 			   0.25mm Drill for 1.6mm  |  		
|  			 
  |  			 			   0.30mm Drill for 2.4mm  |  			 			   0.30mm Drill for 2.4mm  |  		
|  			 Surface Finishes  |  			 			 HASL  |  			 			 HASL  |  		
|  			 
  |  			 			 Selective Immersion Tin  |  			 			 Selective Immersion Tin  |  		
|  			 
  |  			 			 Immersion Silver  |  			 			 Immersion Silver  |  		
|  			 
  |  			 			 Immersion Gold  |  			 			 Immersion Gold  |  		
|  			 
  |  			 			 Hard Gold  |  			 			 Hard Gold  |  		
|  			 
  |  			 			 OSP  |  			 			 OSP  |  		
|  			 
  |  			 			 Gold finger  |  			 			 Gold finger  |  		
|  			 Controlled Impedance  |  			 			 +/- 10%  |  			 			 +/-7%  |  		
|  			 Contouring  |  			 			 Routing, V-Groove,  |  			 			 Routing, V-Groove,  |  		
|  			 
  |  			 			 Beveling Punch  |  			 			 Beveling Punch  |  		
|  			 Hole Diameter  |  			 			 +/- 2 mil  |  			 			 +/- 2 mil  |  		
|  			 Min.S/M Thickness  |  			 			 0.4 mil  |  			 			 0.6 mil  |  		
