High Density FR4 PCB High Frequency Circuit Board For Mobile Base Station
Specification:
|
Number of layer |
6-layer |
|
Base Material |
FR-4 Glass Epoxy laminate |
|
Surface finishing |
HASL |
|
Thickness of copper foil for the basis materials |
18um(1/2OZ),36um(1OZ),72um(2OZ) |
|
Via Holes |
Copper PTH / Blind Via / Buried Via/ HDI 2+N+2 with IVH |
|
Min. Board Thickness |
0.2mm (2 layers)/0.4mm(4layers)/0.9mm(8 layers)/1.2mm(10 layers)/1.3mm (12 layers)/1.5mm (14 layers)/1.7mm (16 layers) |
|
Gild thickness |
0.025um-0.075um |
|
Turmeric thickness |
0.025um-0.15um |
|
Hole wall coating thickness for finished products |
18-25um |
|
Thickness for hard gold gild the golden finger |
0.05um 0.075um 0.100um 0.125um 0.15um |
|
Inner Packing |
Vacuum Package |
|
Outer Packing |
Carton |
Case:
| 6 layers high frequency PCB for Microwave/RF Products |
| 12 layers PCB for Police Equipment |
| 8 layers circuit board for Protocol Analysis |
| Blind Buried Board for Security Industry |
| 4 Layers Mixed Plate(Rogers+FR4) for Military |
| 8 layers Repeat-order HDI board |
| 12 layers PCB & PCBA for Police Equipment |
| 6 layers PCBA for Environmental Test Instruments |
| 24GHZ Rogers PCB for Automatic Door System |
| 5.8GHZ Rogers PCB for Sensor Light |
Description:
We are a profesional FR4 PCB Circuit Board manufacturer in China, and we can offer a various of single sided to multilayer PCB to you.
F (for flame) and R (for retardancies) and the 4 is a 4 epoxy.FR4 is a glass fiber epoxy laminate.FR4 is the Main material for PCB manufacture, it is the excellent quality and reasonable price material
FR-4 is widely used for single and multilayer boards, which has excellent thermal tolerance as much as 130°C. Now this type material FR-4 is more widely manufactured, but the hence is less costly.
Application:
The features of 6-Layers PCB Board is with electric insulation performance stability, good flatness, smooth surface, no pits,
thickness tolerance than standard, suitable for application in high performance electronic insulation requirements of products.