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6 Layer PCB Assembly Black Soldermask and 2OZ Copper Thickness for Optimal Performance
6 Layer PCB Assembly Black Soldermask and 2OZ Copper Thickness for Optimal Performance
6 Layer PCB Assembly Black Soldermask and 2OZ Copper Thickness for Optimal Performance
6 Layer PCB Assembly Black Soldermask and 2OZ Copper Thickness for Optimal Performance
Specifications
Brand Name :
Customisation
Certification :
ISO9001, TS16949
Place of Origin :
China
MOQ :
1pcs
Price :
Negotitation
Payment Terms :
Negotitation, T/T
Packaging Details :
Vacuum package
Product name :
Electronic PCB assembly manufacturer, printed circuit board PCB assembly, Assembly for Circuit Board
Layers :
6 LAYER
Material :
FR4 TG135
Board thickness :
1.6mm+/-10%
Solder mask :
Black
Surface finish :
Immersion Gold
Service :
One-stop Turnkey Service, PCB clone, PCB/Components Sourcing/Soldering/Progamming/Testing.., PCB&PCBA, SMT DIP Components purchase
Type :
Printed circuit assembly
Testing service :
Function test, E-test or fly-probe according to order quantity, Fly-probe, E-test/Fixture test/Functional Test
Application :
Consumer Electronics, and so on, Electronic Products pcb assembly, medicine
Description

Product description:

Product type Printed circuit board Assembly
Multilayer 6 layer
Material FR4 Tg135 1.6mm
Copper thickness 2/1/1/1/1/2OZ
Surface finish Immersion gold
Soldermask Black

PCBA :Assembly Tehcnologies:

Surface Mount Technology (SMT): Components are mounted directly onto the surface of the PCB. This technology allows for smaller components and denser PCB layouts.

Through-Hole Technology (THT): Components with wire leads are inserted into holes in the PCB and soldered on the opposite side. THT is used for components requiring mechanical strength or heat dissipation.

Automated Optical Inspection (AOI): AOI systems use cameras and image processing algorithms to inspect solder joints and components for defects such as misalignment, missing components, or solder bridges.

X-Ray Inspection: X-ray machines are used to inspect hidden solder joints, check for voids in solder, and ensure the integrity of components like ball grid arrays (BGAs).

In-Circuit Testing (ICT): ICT involves testing the electrical connections on the PCB using test probes. This method is used to detect faults like open circuits, shorts, and incorrect components.

Flying Probe Testing: Instead of using dedicated test fixtures, flying probe testers have moving test probes that can adapt to various PCB designs, making them suitable for low-volume production.

Functional Testing: This involves testing the PCB while it is operational to ensure that it functions according to the design specifications.These processes and technologies collectively ensure the quality and reliability of PCB assemblies in electronic devices.

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6 Layer PCB Assembly Black Soldermask and 2OZ Copper Thickness for Optimal Performance

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Product Detail
Brand Name :
Customisation
Certification :
ISO9001, TS16949
Place of Origin :
China
MOQ :
1pcs
Price :
Negotitation
Payment Terms :
Negotitation, T/T
Contact Supplier
6 Layer PCB Assembly Black Soldermask and 2OZ Copper Thickness for Optimal Performance
6 Layer PCB Assembly Black Soldermask and 2OZ Copper Thickness for Optimal Performance

GT SMART (Changsha) Technology Co., Limited

Verified Supplier
3 Years
guangdong, shenzhen
Since 2008
Business Type :
Manufacturer
Main Products :
Flexible PCB Board, ID Card Holder Lanyard, Rigid PCB
Total Annual :
500million-1000million
Employee Number :
300~400
Certification Level :
Verified Supplier
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