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High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type
High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type
Specifications
Place of Origin :
China
Brand Name :
Customized
Certification :
ISO9001, ISO13485,IS014001
MOQ :
1 panel
Price :
Negotiation
Payment Terms :
T/T
Delivery Time :
7-12 days
Packaging Details :
Vacuum package
Board type :
6 layer
Base Material :
FR4/ROGERS/High Tg
Solder Mask :
Green Solder Mask
Minimum Solder Mask Bridge :
0.1mm
Surface finish :
EING
Service Type :
PCB Prototype/ Mass Production
Size :
Customized
Cu Thickness :
1OZ
Maximum Substrate Size :
24”x32”
Description

Product Description:

The HDI PCB is a high density interconnect printed circuit board designed to meet the demanding requirements of modern electronic applications. With its advanced manufacturing techniques and superior material choices, this product ensures exceptional performance, reliability, and precision in complex circuit designs. The HDI PCB features an impressive minimum line space of 0.075mm, allowing for extremely fine circuit patterns that support miniaturization and high functionality in compact spaces. This capability makes it an ideal solution for cutting-edge electronics where space savings and high circuit density are critical.

HDI PCB Design DFM Requirements

Normally, DFM requirements relating to clearances in HDI PCB are quite strict, but it can be come tured by taking advantage of your design rules in your PCB design software. Some of the important DFM requirements to gather before layout and routing include:

  • Circuit width and spacing limits
  • Annular ring and aspect ratio limits, especially for high reliability designs and requirements
  • Material choice used in the board to ensure impedance control in the required stackup
  • Impedance profiles for the desired stackup or layer pairs if available
  • Blind vias connect exterior layer to at least one interior layer without penetrating the entire board.
  • Buried vias connect one or more inner layers together without any connections to the exterior layers of a board.
  • Any layer HDI refers to the use of stacked copper-filled microvias to connect multiple layers in a PCB.

High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type

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High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type

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Product Detail
Place of Origin :
China
Brand Name :
Customized
Certification :
ISO9001, ISO13485,IS014001
MOQ :
1 panel
Price :
Negotiation
Payment Terms :
T/T
Contact Supplier
High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type

GT SMART (Changsha) Technology Co., Limited

Verified Supplier
4 Years
guangdong, shenzhen
Since 2008
Business Type :
Manufacturer
Main Products :
Flexible PCB Board, ID Card Holder Lanyard, Rigid PCB
Total Annual :
500million-1000million
Employee Number :
300~400
Certification Level :
Verified Supplier
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