Description
IH890S is a polyimide film backed Acrylic adhesive tape with excellent heatresistance and insulation properties.
Construction

Features
Resistant high temperature up to 260℃.
No residue after removal.
Excellent anti-aging ability, long shelf life.
Application
Masking or protecting residue sensitive areas on printed circuit boards during
high temperature operations such as wave soldering and solder reflow
Properties
| Item |
Typical Value |
Test Method |
| Imperial |
Metric |
| Backing |
1.0mil |
0.025mm |
/ |
| Total Thickness |
1.38±0.2mil |
0.035±0.005mm |
/ |
| Adhesion to Steel |
0.45~0.79lbs/in |
2~3.5N/25mm |
GBT 2792-2014 |
| Tensile Strength |
≥28lbs/in |
≥5(KN/M) |
GBT 30776-2014 |
| Elongation |
≥45% |
≥45% |
GBT 30776-2014 |
|
Maximum Operating
Temperature
|
500℉ |
260℃*5min |
No residue after removal |
Storage
Store under normal conditions of 10-30℃ and 40-70% R.H, out of direct sunlight.
Shelf life: 12 months from the date of manufacture when stored in initial packing.
Precaution Reminder
Surface should be clean, dry, free of dust, oil or other contaminants.
Proper pressure required by roller, hand or press when applying.
Avoid repeat sticking to prevent adhesion decrease.
Notes
Please be advised that this technical data sheet is written based on our lab tests and experience only. Customer is responsible to determine the suitability of the product meets intended application requirements before approved for use.