Application | Electronics ChemicalsEpoxy curing agent Reacts quickly with isocyanates |
Type | Adsorbent |
Appearance | LIGHT YELLOW TRANSPARENT LIQUID |
AMINE VALUE (MGKOH/G) | 580-630 |
VISCOSITY (MPA.S,25℃) | 120-260 |
WATER (%) | 0.5MAX |
DENSITY (25℃) | 0.97-0.99 |
Co-curing Agent:
DMP-30 can be used as a co-curing agent or activator for other curing agents, like polyamides and fatty amidoamines, in epoxy systems
Epoxy Resin Curing Agent:
DMP-30 is widely used as a curing agent for epoxy resins in applications like casting, laminating, sealing, dipping, and insulation coatings
Low Temperature Cure:
It facilitates fast cure rates at ordinary temperatures, making it suitable for applications where rapid solidification is needed
Other Applications:
Beyond epoxy resins, DMP-30 is also used as a catalyst in the production of urethane elastomers, isocyanurate foams, and isocyanate trimerization
Specific Examples:
It's used in fast-curing epoxy potting compounds, encapsulation materials, adhesives, and flooring coatings. It's also used in lamination and adhesive applications
Polyisocyanurate Foam Production:
It can be used in the production of rigid polyisocyanurate foams, acting as a delayed-action trimerization catalyst