1. Introduction

2. Key Features

2.1 Automated Process Control

• Precision Parameter Management: At the heart of this equipment lies a sophisticated automated control system. Using advanced programmable logic controllers (PLCs) and intuitive software interfaces, every aspect of the electroplating process can be precisely regulated. Parameters such as plating time, current density, temperature, and chemical concentration of the plating bath are monitored and adjusted in real - time. For example, when plating PCBs, the system can accurately control the current density to ensure uniform copper deposition across the board's surface. This precision is crucial for maintaining the integrity of electrical traces and ensuring optimal performance of the final product.
• Seamless Workflow Integration: The automated control system enables seamless integration of different stages of the plating process. From the pre - treatment of the metal substrate, which involves cleaning, degreasing, and surface activation, to the actual electroplating and post - treatment steps like rinsing and drying, the equipment can manage the entire workflow without manual intervention. This not only reduces the risk of human error but also accelerates the overall production cycle.

2.2 High - Efficiency Plating Chambers

• Optimized Design for Uniform Coating: The plating chambers are engineered with a focus on achieving uniform metal deposition. They feature innovative agitation and circulation systems that ensure the plating solution is evenly distributed around the workpiece. In the case of PCB electroplating, specialized fixtures are used to hold the boards in place, allowing the solution to reach all areas, including the smallest vias and traces. This results in a consistent coating thickness across the entire PCB, which is essential for reliable electrical connections.
• High - Volume Processing Capacity: To meet the high - volume production requirements of the electronics industry, the plating chambers are designed to handle multiple workpieces simultaneously. For example, in the production of small electronic components like connectors or capacitors, the chambers can be configured to accommodate a large number of parts in a single plating cycle. This significantly increases the throughput of the equipment, enabling manufacturers to meet tight production schedules.

2.3 Advanced Plating Technology

• Selective Plating Capabilities: This metal plating equipment offers selective plating options, which are particularly useful for PCB manufacturing. Selective plating allows for the deposition of metal only in specific areas of the PCB, reducing the amount of plating material used and minimizing the risk of short - circuits. Using advanced masking techniques and precise control of the electrical current, the equipment can accurately target the areas that require plating, such as the pads for component soldering or the traces for signal transmission.
• Multi - Layer Plating for Enhanced Performance: In many electronic applications, multi - layer plating is essential to achieve the desired combination of properties. The equipment is capable of depositing multiple layers of different metals, such as a base layer of copper for electrical conductivity, followed by a layer of nickel for corrosion resistance and a top layer of gold for enhanced solderability and durability. This multi - layer plating process can be precisely controlled to ensure the integrity and performance of the plated components.

2.4 Energy - Saving and Environment - Friendly Design

• Energy - Efficient Operation: The equipment is designed with energy - saving features to reduce operational costs and environmental impact. Advanced power management systems are employed to optimize the use of electrical energy during the plating process. For example, the system can adjust the power supply based on the real - time requirements of the plating operation, reducing energy consumption without sacrificing plating quality.
• Waste Management and Recycling: In line with environmental sustainability goals, the metal plating equipment incorporates waste management and recycling systems. The plating baths are equipped with filtration and purification units to remove impurities and extend the lifespan of the plating solution. Additionally, the equipment can recover and recycle valuable metals from the waste stream, reducing the need for virgin metal extraction and minimizing environmental pollution.

3. Specifications

4. Benefits for Electronic Product Manufacturers

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