Specifications
Package Type :
BGA (Ball Grid Array) 153
Material :
Plastic
Condition :
Good Quality
Memory :
Flash
Working Temperature :
-45~105℃
Origin :
Guangdong, China
Oem :
Welcome
Brand Name :
PG
Place of Origin :
Shenzhen, China
Price :
Negotiable
Payment Terms :
L/C,T/T
Supply Ability :
100K a month
Delivery Time :
10 to 15 days
Model Number :
G2864TLCA/ G28128TLCA/ G28256TLCA
MOQ :
50pcs
Description
eMMC 5.1 Automotive Grade Memory IC Chips
High-performance BGA 153 memory chips operating stably from -40℃ to 105℃, designed for automotive applications including ADAS aftermarket systems.
Technical Specifications
Parameter Details
Interface eMMC 5.1 with HS400 support
Capacities 64GB, 128GB, 256GB
Data Transfer Speed Up to 400MB/s (HS400 mode)
Operating Voltage 3.3V (VCC), 1.8V/3.3V (VCCQ)
Temperature Range -40°C to 105°C
Endurance High endurance for frequent read/write cycles
Security RPMB, secure boot, and write protection
Package BGA (Ball Grid Array)
Package Size 11.5 x 13 x 1 mm
eMMC 5.1 Automotive Grade Operating Stably in the Range of -40℃~105℃ BGA 153 Memory IC Chips eMMC 5.1 Automotive Grade Operating Stably in the Range of -40℃~105℃ BGA 153 Memory IC Chips
ADAS Aftermarket System Applications
As a highly integrated and reliable storage solution, eMMC (Embedded MultiMediaCard) serves as the core data-supporting component for ADAS aftermarket systems, especially blind spot monitoring and lane change assist functions. Leveraging its automotive-grade environmental durability, low-latency read/write performance, and standardized compatibility, eMMC precisely meets the requirements of rapid integration and complex operating conditions for aftermarket devices.
eMMC provides full-link data assurance for blind spot monitoring and lane change assist systems:
  • Caches real-time raw sensing data from millimeter-wave radars and cameras to prevent data loss
  • Stores local feature libraries and algorithm models for offline obstacle identification
  • Records lane change decision logs and abnormal event data for fault diagnosis
  • Supports A/B partition OTA upgrades for stable system operation during updates
Performance & Capacity Requirements
The mainstream choice adopts the eMMC 5.1 protocol, supports HS400 mode, and achieves sequential read speeds of ≥ 330MB/s. Capacity options from 64GB to 256GB are available to match the complexity of different functions.
Automotive-Grade Reliability & Security
All products are AEC-Q100 certified with an operating temperature range of -40℃ to 105℃, capable of withstanding extreme vehicle operating environments. Combined with ECC error correction, wear leveling, and power-failure protection features, eMMC ensures data integrity and meets long-life operation requirements in automotive scenarios.
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eMMC 5.1 Automotive Grade Operating Stably in the Range of -40℃~105℃ BGA 153 Memory IC Chips

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Package Type :
BGA (Ball Grid Array) 153
Material :
Plastic
Condition :
Good Quality
Memory :
Flash
Working Temperature :
-45~105℃
Origin :
Guangdong, China
Contact Supplier
eMMC 5.1 Automotive Grade Operating Stably in the Range of -40℃~105℃ BGA 153 Memory IC Chips

China Chips Star Semiconductor Co., Ltd.

Verified Supplier
2 Years
guangdong, shenzhen
Since 2019
Business Type :
Manufacturer, Seller
Employee Number :
260~300
Certification Level :
Verified Supplier
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