256GB eMMC 5.1 for Industrial Automation Equipment
High-performance 256GB eMMC 5.1 storage solution specifically engineered for industrial automation applications requiring 24/7 uninterrupted read/write operations with enhanced anti-interference capabilities.
Product Specifications
| Model |
G2864GTLCB |
G28128TLCB |
G28256TLCB |
| NAND Flash |
3D TLC NAND |
3D TLC NAND |
3D TLC NAND |
| Capacity |
64GB |
128GB |
256GB |
| CE |
1 |
2 |
4 |
| Read Speed |
up to 330MB/s |
up to 330MB/s |
up to 330MB/s |
| Write Speed |
up to 240MB/s |
up to 240MB/s |
up to 240MB/s |
| Operating Temperature |
-25℃~85℃ |
-25℃~85℃ |
-25℃~85℃ |
| EP |
≥3000 |
≥3000 |
≥3000 |
| Packaging Specification |
BGA 153 |
BGA 153 |
BGA 153 |
| Size |
11.5mm*13mm*1.0mm |
11.5mm*13mm*1.0mm |
11.5mm*13mm*1.2mm |
Connection Bridge: Packaging Substrate and Interface
The packaging substrate serves as the physical carrier of the eMMC module, providing mechanical support and electrical connectivity between the MMC controller and NAND flash memory chip. The interface functions as the communication bridge between eMMC and the host system, adhering to JEDEC standardized interface specifications.
Key Interface Features
- Parallel bus architecture with comprehensive pin configuration
- Power supply pins (VCC, VCCQ) for stable operation
- Data pins (D0-D7) supporting 8-bit data transfer
- Clock pin (CLK) and command pin (CMD) for synchronization
- 8-bit data bus enables double the data transmission rate compared to 4-bit bus at identical clock frequencies