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High Endurance pSLC eMMC Module 153 Ball FBGA Package eMMC 5.1 for Smart Wearable 
High Endurance pSLC eMMC Module 153 Ball FBGA Package eMMC 5.1 for Smart Wearable 
High Endurance pSLC eMMC Module 153 Ball FBGA Package eMMC 5.1 for Smart Wearable 
High Endurance pSLC eMMC Module 153 Ball FBGA Package eMMC 5.1 for Smart Wearable 
Specifications
MOQ :
50pcs
Manufacturer :
NUW Brand，China Chips Star
Place of Origin :
Shenzhen, China
Packeage Type :
153BGA
Payment Terms :
L/C,T/T
Aplication :
Smart Wearable
Condition :
New
Delivery Time :
3 to 15 days
Write Speed :
240MB/S
Supply Ability :
100K a month
Error Correction :
Built-in ECC (Error Correction Code)
Material :
plastic
Price :
Negotiable
Chip :
Hynix V7
Brand Name :
PG
Protocol :
HS400
Sequential Write Speed :
Up To 240 MB/s
Description
High Endurance pSLC eMMC Module 153 Ball FBGA Package eMMC 5.1 for Smart Wearable

The High Endurance pSLC eMMC Module with 153 Ball FBGA Package is a high-reliability embedded storage solution designed for smart wearables, IoT devices, medical wearable equipment, industrial terminals, and edge AI applications.

Based on eMMC 5.1 interface technology, this module integrates NAND Flash and an intelligent controller with advanced LDPC ECC error correction, wear leveling, bad block management, and optimized firmware algorithms. The pSLC mode enhances endurance and data reliability compared with traditional TLC NAND, making it suitable for devices requiring frequent data writing, long operating cycles, and stable performance.

Embedded eMMC 5.1 Specifications
Parameter Specification
Product Type Embedded Multimedia Card (eMMC IC Chip)
Application Smart Wearable / Smart Display
Capacity 4GB / 8GB / 16GB / 32GB / 64GB
Interface eMMC 5.1
NAND Flash Type 3D NAND Flash
Package BGA153
Error Correction LDPC ECC
Operating Voltage 1.8V / 3.3V
Performance Mode HS400 Supported
Data Protection ECC, Wear Leveling, Bad Block Management
Operating Temperature Commercial: 0°C to 70°C / Industrial Option: -25°C to 85°C
Storage Temperature -25°C to 85°C
Form Factor Embedded IC Package 153
Application Life Cycle Long-term Supply Support
Why Choose China Chips Star?
Professional Embedded Storage Manufacturer

China Chips Star Semiconductor specializes in:

  • eMMC 5.1 storage solutions
  • Industrial memory cards
  • Automotive-grade storage
  • NAND Flash storage products

With dedicated R&D and testing capabilities, China Chips Star provides customized embedded storage solutions for global customers.

High-Endurance Storage Technology

China Chips Star develops storage solutions based on advanced NAND management technologies:

  • pSLC mode optimization
  • LDPC ECC algorithm
  • Flash lifetime management
  • Firmware optimization

Providing higher reliability for write-intensive applications.

Product Images
High Endurance pSLC eMMC Module 153 Ball FBGA Package eMMC 5.1 for Smart Wearable 

High Endurance pSLC eMMC Module 153 Ball FBGA Package eMMC 5.1 for Smart Wearable 

High Endurance pSLC eMMC Module 153 Ball FBGA Package eMMC 5.1 for Smart Wearable 

High Endurance pSLC eMMC Module 153 Ball FBGA Package eMMC 5.1 for Smart Wearable 

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High Endurance pSLC eMMC Module 153 Ball FBGA Package eMMC 5.1 for Smart Wearable 

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Product Detail
MOQ :
50pcs
Manufacturer :
NUW Brand，China Chips Star
Place of Origin :
Shenzhen, China
Packeage Type :
153BGA
Payment Terms :
L/C,T/T
Aplication :
Smart Wearable
Contact Supplier
High Endurance pSLC eMMC Module 153 Ball FBGA Package eMMC 5.1 for Smart Wearable 
High Endurance pSLC eMMC Module 153 Ball FBGA Package eMMC 5.1 for Smart Wearable 

China Chips Star Semiconductor Co., Ltd.

Verified Supplier
3 Years
guangdong, shenzhen
Since 2019
Business Type :
Manufacturer, Seller
Main Products :
eMMC5.1, Industrial Grade eMMC5.1, Automotive Grade eMMC5.1
Employee Number :
260~300
Certification Level :
Verified Supplier
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