Electric Coolant Pump OWP-BL43-426C: Ideal for Reflow Oven Liquid Cooling Systems
The Electric Coolant Pump OWP-BL43-426C is a high-performance solution designed to meet the demanding heat dissipation needs of industrial equipment, with a primary focus on reflow oven liquid cooling applications. Its robust design, precise control, and wide compatibility make it a reliable choice for enhancing thermal management efficiency in electronic manufacturing processes.
Technical Specifications Table
| Parameter |
Details |
| Power Input |
24VDC (18-32VDC) |
| Rated Power |
240W |
| Rated Flow Rate |
2400L/H @ H=17M |
| Maximum Flow Rate |
5000L/H |
| Maximum Lift Head |
20M |
| Compatible Mediums |
Glycol (50-60%) + water, dielectric oil, mineral oil, electronic fluorinated solution, etc. |
| Connection Type |
Flange Quick-Connect |
| Speed Regulation |
PWM |
| Fault Feedback |
Yes |
| IP Grade |
IP68 |
| Noise Level |
≤60dB |
| Service Life |
>20000hours |
| Working Ambient Temperature |
-40℃ to +85℃ (-40°F to +185°F) |
| Humidity Resistance |
≤90% |
| Connector Model |
AMP282106-1 (Matched plug: AMP282088-1) |
| Nozzle Size |
50.5mm (Flange) |
Key Applications
The pump is primarily engineered for industrial thermal management, with its most critical use case centered on reflow oven liquid cooling systems (the core application for electronic manufacturing):
- Ensures precise post-soldering cooling: Reflow ovens require rapid, uniform cooling after the heating phase to avoid solder defects (e.g., tombstoning, cold joints) and protect sensitive PCB components. The pump circulates cooling mediums (glycol-water mixtures, dielectric oil, etc.) to absorb heat efficiently, maintaining stable thermal conditions during soldering.
- Adapts to industrial reflow oven demands: Its high rated flow rate (2400L/H @ H=17M, max 5000L/H) and 20M max lift head support reliable fluid circulation even in large, high-power reflow ovens, covering the thermal needs of both standard PCBs and dense semiconductor packages.
- Withstands harsh oven environments: Operates seamlessly in reflow oven workspaces—thanks to a wide ambient temperature range (-40℃ to +85℃) and IP68 dust/liquid protection—ensuring durability in manufacturing settings where temperature fluctuations and debris are common.
- Enables recipe-based cooling control: PWM speed regulation lets operators adjust flow rates to match specific reflow soldering recipes, optimizing cooling for different PCB densities or component types (e.g., high-power vs. low-power PCBs).
Core Advantages
- Superior protective features:
- Prevents operational failures: Equipped with reverse polarity protection, dry running protection, and safeguards against over-voltage, over-current, overload, and over-temperature—minimizing downtime and extending the pump’s service life.
- Maintains stable performance: Built-in constant flow control ensures consistent cooling medium circulation, avoiding temperature inconsistencies that could harm reflow soldering quality.
- Reliable & long-lasting design:
- Leak-free operation: Uses magnetic force transmission (shield pump structure) to eliminate fluid leakage risks, critical for handling cooling mediums in precision manufacturing.
- High-efficiency, durable motor: A brushless DC motor reduces power consumption while delivering a service life of over 20,000 hours, lowering long-term maintenance and replacement costs.
- User-friendly & versatile:
- Easy installation/maintenance: Flange quick-connect design simplifies setup and disassembly, saving time for factory technicians.
- Low operational noise: Operates at ≤60dB, improving workplace comfort in manufacturing facilities.
Wide medium compatibility: Works with glycol-water (50-60%), dielectric oil, mineral oil, and electronic fluorinated solutions, adapting to diverse reflow oven cooling system requirements.
PMW Speed Regulation Mode & Fault Feedback
Performance Curve
Dimensions Diagram