10-Pair Super-Mini Splicing Moisture-proof Module Gel
This 10-Pair Splicing Module with Gel delivers in place performance withstanding extended exposure to various conditions of extremely high humidity, including water immersion, while maintaining insulation resistance and circuit integrity.
Housing Material | PC (UL 94v-0) without gel | Contacts Material | Tinned Phosphor Bronze |
Wire Insertion Force | 45N Typical | Wire Pull-Out Force | 40N Typical |
Max Insulation Diameter | 1.65 mm | Cable Style and Wire Diameter | 0.32-0.65 mm(28-22 AWG) |
Application: