Specifications
Layers :
8 Layer
Materials :
FR4
Board Thickness :
1.6mm
Soldmask :
Green, Red, Blue, Black, White
Silk Screen :
White
Pcb Standard :
IPC-A-610 E Class II-III,IPC-II Standard
Name :
PCBA Assembly
Description
Our surface mount technology utilizes high-speed Fuji NXT feeders and Mycronic MY500 systems for precision placement of 01005 chips to large BGAs. Nitrogen reflow ovens with closed-loop thermal profiling ensure voiding rates below 15%, while 3D SPI machines verify solder paste volume pre-reflow. This automated process guarantees exceptional repeatability for high-density designs in medical wearables, IoT modules, and communication devices where component miniaturization is critical.
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SMT Assembly

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Layers :
8 Layer
Materials :
FR4
Board Thickness :
1.6mm
Soldmask :
Green, Red, Blue, Black, White
Silk Screen :
White
Pcb Standard :
IPC-A-610 E Class II-III,IPC-II Standard
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SMT Assembly

DuxPCB Technologies Co., Ltd.

Verified Supplier
1 Years
shenzhen
Since 2007
Business Type :
Manufacturer
Total Annual :
10 Million USD-50 Million
Employee Number :
201~500
Certification Level :
Verified Supplier

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