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Steel Body Diamond Grinding Wheel Back & Front Rough And Finish Grinding
Steel Body Diamond Grinding Wheel Back & Front Rough And Finish Grinding
Steel Body Diamond Grinding Wheel Back & Front Rough And Finish Grinding
Steel Body Diamond Grinding Wheel Back & Front Rough And Finish Grinding
Steel Body Diamond Grinding Wheel Back & Front Rough And Finish Grinding
Steel Body Diamond Grinding Wheel Back & Front Rough And Finish Grinding
Steel Body Diamond Grinding Wheel Back & Front Rough And Finish Grinding
Steel Body Diamond Grinding Wheel Back & Front Rough And Finish Grinding
Specifications
Brand Name :
Hongtuo
Model Number :
HT-BGW
Certification :
ISO9001:2015
Place of Origin :
China (Mainland)
MOQ :
2
Price :
Price can be negotiated
Payment Terms :
T/C,T/T
Supply Ability :
300/pcs per month
Delivery Time :
2-3weeks
Packaging Details :
Carton Box
Name :
Silicon Wafer Back Grinding Wheels
Applications :
Semiconductor silicon
Space code :
6A2 or 14A1
Finishing :
Nitride
Body :
STEEL
Structure :
With flange or without
Description

Back Grinding Wheel Silicon Wafer Back & Front Rough and Finish Grinding

Hongtuo, as a major designer, manufacturer and distributor of diamond and CBN grinding wheels, can offer an excellent selection of back grinding wheels. This particular grinding tool comes in two types: a silicon wafer back grinding wheel and an LED substrate back grinding wheel. Both of them can be used on different grinding machines made in Europe,America,Japan, and China. They also feature a stable performance and a high cost effectiveness.

Silicon Wafer Back Grinding Wheel

This abrasive wheel is primarily used for thinning and finishing semiconductor wafers. It comes with a superior grinding performance and a low coast. It can be used on grinding machines manufactured in Japan,Germany and China.

Grinding Objects: Discrete devices, IC substrate silicon wafers and original silicon wafers

Processes: Back to front rough and fine grinding

Application: Semiconductor silicon, Wafer Back & Front Rough and Finish Grinding.

Work Piece Materials: Monocrystalline silicon and other semiconductor materials.

Steel Body Diamond Grinding Wheel Back & Front Rough And Finish Grinding

Product tags

industrial diamond grinding wheels

,

diamond edge grinding wheels

,

grinding carbide with diamond wheel
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Steel Body Diamond Grinding Wheel Back & Front Rough And Finish Grinding

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Product Detail
Brand Name :
Hongtuo
Model Number :
HT-BGW
Certification :
ISO9001:2015
Place of Origin :
China (Mainland)
MOQ :
2
Price :
Price can be negotiated
Contact Supplier
Steel Body Diamond Grinding Wheel Back & Front Rough And Finish Grinding
Steel Body Diamond Grinding Wheel Back & Front Rough And Finish Grinding
Steel Body Diamond Grinding Wheel Back & Front Rough And Finish Grinding
Steel Body Diamond Grinding Wheel Back & Front Rough And Finish Grinding

Zhengzhou Hongtuo Superabrasive Products Co., Ltd.

Active Member
8 Years
henan, zhengzhou
Since 1997
Business Type :
Manufacturer, Importer, Exporter, Seller
Main Products :
Diamond Honing Tool, Single Pass Honing Tools, Cylinder Honing Tool
Total Annual :
5000000-10000000
Employee Number :
400~500
Certification Level :
Active Member
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