| Material Structure |
4-layer composite: Static-dissipative polyethylene (outer layer) / Aluminum shielding / Polyester (middle layer) / Static-dissipative coating (inner layer)
. Optimized for surface resistance control. |
| Surface Resistance |
≤10¹² Ω/sq (anti-static range)
, compliant with ANSI/ESD S541 and IEC 61340-5-1 standards. |
| Certifications |
ISO 9001, ISO 14001
, and RoHS/REACH compliance
. Suitable for electronics in EPA (ESD Protected Areas)
. |
| Barrier Properties |
Moisture-resistant (WVTR ≤5 g/m²·24h at 38°C/90% RH)
; moderate oxygen barrier (OTR ≤50 cm³/m²·day). |
| Design Features |
Octagonal bottom for stability; heat-sealable or zip-lock closure
; customizable print area for branding. |
| Applications |
PCB, RAM, motherboards, IC chips, and other ESD-sensitive components
. |
| Sustainability |
Recyclable polyethylene layers; optional biodegradable additives
. |