Material Structure | 4-layer composite: Static-dissipative polyethylene (outer layer) / Aluminum shielding / Polyester (middle layer) / Static-dissipative coating (inner layer) . Optimized for surface resistance control. |
Surface Resistance | ≤10¹² Ω/sq (anti-static range) , compliant with ANSI/ESD S541 and IEC 61340-5-1 standards. |
Certifications | ISO 9001, ISO 14001 , and RoHS/REACH compliance . Suitable for electronics in EPA (ESD Protected Areas) . |
Barrier Properties | Moisture-resistant (WVTR ≤5 g/m²·24h at 38°C/90% RH) ; moderate oxygen barrier (OTR ≤50 cm³/m²·day). |
Design Features | Octagonal bottom for stability; heat-sealable or zip-lock closure ; customizable print area for branding. |
Applications | PCB, RAM, motherboards, IC chips, and other ESD-sensitive components . |
Sustainability | Recyclable polyethylene layers; optional biodegradable additives . |