Specifications
Model Number :
H9TQ26ADFTACUR-KUM
Certification :
Original Parts
MOQ :
1 piece
Price :
Negotiation
Payment Terms :
T/T, PayPal, Western Union, Escrow and others
Packaging Details :
10cm X 10cm X 5cm
Supply Ability :
500-2000pcs per month
Delivery Time :
3-5 work days
Part Numbe :
H9TQ26ADFTACUR-KUM
Application :
Mobile Phone
Product :
eMCP
Density :
32GB
NAND Information :
32+24 eMCP-D3
Package Type :
221 ball FBGA
Dissipation Power :
5W
Description

EMCP Memory Chip H9TQ26ADFTACUR-KUM -32GNAND+24GLPD3 FBGA221 FW:A4-Embedded Multi-Chip Package NEW&ORIGINAL Storage

Featur and Description:

Part Number Density Organization Temperature Product Grade Voltage PKG Product Status
H9TQ26ADFTACUR-KUM 32GB SDP 1℃-100℃ IT 5v FBGA221 Mass Production
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32GNAND+24GLPD3 FBGA221 FW A4 Embedded Multi Chip Package , Mcp Flash H9TQ26ADFTACUR-KUM

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Model Number :
H9TQ26ADFTACUR-KUM
Certification :
Original Parts
MOQ :
1 piece
Price :
Negotiation
Payment Terms :
T/T, PayPal, Western Union, Escrow and others
Packaging Details :
10cm X 10cm X 5cm
Contact Supplier
32GNAND+24GLPD3 FBGA221 FW A4 Embedded Multi Chip Package , Mcp Flash H9TQ26ADFTACUR-KUM
32GNAND+24GLPD3 FBGA221 FW A4 Embedded Multi Chip Package , Mcp Flash H9TQ26ADFTACUR-KUM
32GNAND+24GLPD3 FBGA221 FW A4 Embedded Multi Chip Package , Mcp Flash H9TQ26ADFTACUR-KUM

Beijing Silk Road Enterprise Management Services Co.,LTD

Verified Supplier
8 Years
Since 2009
Business Type :
Distributor/Wholesaler, Agent, Importer, Exporter, Trading Company, Seller
Total Annual :
5000000-10000000
Employee Number :
100~120
Certification Level :
Verified Supplier
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