Specifications
Model Number :
K3RG3G30MM-MGCH
Certification :
Original Parts
MOQ :
1 package
Price :
Negotiation
Payment Terms :
T/T, PayPal, Western Union, Escrow and others
Supply Ability :
6000pcs per month
Delivery Time :
3-5 work days
Packaging Details :
10cm X 10cm X 5cm
Item number :
K3RG3G30MM-MGCH
Market :
Mobile
Density :
3GB
Package :
BGA336
Description


DRAM Memory Chip K3RG3G30MM-MGCH 3GB LPDDR Memory Chip

Feature:

Lifecyle :Active

EU RoHS :Unknown

EU RoHS Version:2002/95/EC

Description: M-DIE LOW POWER DDR4 DRAM 24GB DENSITY Taxonomy

Memory > Memory Chips > DRAM Chip

Introduction Date:2016-01-19 00:00:00

ECCN:EAR99

Supplier Cage Code:1542F

Basic Package Type:Ball Grid Array

Package Family Name:BGA

Supplier Package:FBGA

Package Description:Fine Pitch Ball Grid Array

Lead Shape:Ball

Pin Count:366

PCB:366

Tab:N/R

Package Length (mm):N/A

Package Width (mm):N/A

Package Height (mm):N/A

Package Diameter (mm):N/R

Package Weight (g):N/A

Mounting:Surface Mount

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DRAM Memory Chip , K3RG3G30MM-MGCH 3gb Lpddr3 Memory Chip Storage

Ask Latest Price
Model Number :
K3RG3G30MM-MGCH
Certification :
Original Parts
MOQ :
1 package
Price :
Negotiation
Payment Terms :
T/T, PayPal, Western Union, Escrow and others
Supply Ability :
6000pcs per month
Contact Supplier
DRAM Memory Chip , K3RG3G30MM-MGCH  3gb Lpddr3  Memory Chip Storage

Beijing Silk Road Enterprise Management Services Co.,LTD

Verified Supplier
8 Years
Since 2009
Business Type :
Distributor/Wholesaler, Agent, Importer, Exporter, Trading Company, Seller
Total Annual :
5000000-10000000
Employee Number :
100~120
Certification Level :
Verified Supplier
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