0.022mm Electrolytic Copper Foil & Strip Copper Foil for PCB Manufacturing – Customized Size, 99.9% Copper Purity

Product Description:

Our Copper Foil is a premium quality copper material designed for use in PCB manufacturing and chip packaging applications. With a purity of 99.9% and a highly refined microstructure, this copper foil offers exceptional electrical conductivity, thermal properties, and corrosion resistance. The foil is manufactured through a heat treatment process that ensures minimal oxygen content, resulting in a uniform and high-quality product. It is customizable in size and thickness, making it ideal for various industrial uses, including the lithium battery industry.

Key Features:

• High Purity Copper: Contains over 99.9% copper content, ensuring excellent electrical conductivity and superior performance.

• Customizable Sizes: Available in thicknesses from 0.006mm to 0.105mm, and widths ranging from 250mm to 1280mm.

• Fine Microstructure: The electrolytic process results in a refined microstructure with low oxygen content, enhancing material strength and durability.

• Superior Electrical & Thermal Conductivity: Ensures efficient energy transfer and high heat resistance, making it ideal for use in electronic components and batteries.

• Excellent Ductility and Corrosion Resistance: Offers improved processing and resistance to corrosion, ensuring longer-lasting and reliable performance in various environments.

Specifications:

• Printed Circuit Boards (PCBs): Ideal for the manufacturing of high-quality PCBs used in various electronic devices, ensuring optimal conductivity and reliability.

• Chip Packaging: Perfect for use in chip packaging materials, offering superior durability and protection.

• Lithium Battery Industry: Essential for applications in lithium-ion batteries, enhancing electrical conductivity and efficiency.

• Electronics and Communication Devices: Used in a wide range of electronic devices requiring high-performance copper foil for optimal signal transmission and heat dissipation.

How It Works:

The HTE Electrolytic Copper Foil functions as a conductive layer in printed circuit boards and electronic devices. Its high electrical conductivity ensures smooth and efficient transmission of signals, while the excellent thermal properties help dissipate heat in sensitive electronic components. The low oxygen content and fine microstructure of the foil allow it to be used in high-precision applications, providing superior performance and reliability over time.

PACKING AND SHIPPING:

FAQ (Frequently Asked Questions):

• What is the primary application of this copper foil?
  This copper foil is primarily used in the manufacturing of printed circuit boards (PCBs) and chip packaging materials, as well as in lithium battery production.

• What are the benefits of using this copper foil in PCBs?
  The high purity of the copper foil (99.9%) ensures superior electrical conductivity, while its fine microstructure and excellent thermal properties help prevent overheating, making it ideal for high-performance PCBs.

• Can I customize the size and thickness of the copper foil?
  Yes, the copper foil is available in a wide range of thicknesses (0.006mm - 0.105mm) and widths (250mm - 1280mm), allowing for customization to suit your specific needs.

• How does the heat treatment process improve the copper foil?
  The heat treatment process reduces oxygen content, ensuring the copper foil has minimal air holes, high porosity, and excellent surface accuracy. This process enhances its electrical conductivity, mechanical strength, and corrosion resistance.

• Is the copper foil suitable for high-temperature applications?
  Yes, the copper foil exhibits excellent thermal properties, making it suitable for applications that involve high temperatures, such as lithium battery anode materials and high-performance electronics.

• What is the packaging method for the copper foil?
  The copper foil is packaged in a standard export seaworthy package, or as per your specific requirements, to ensure safe and secure delivery.