Product Overview
The Z-PACK 2 mm HM Interconnection System is a robust board-to-board connection solution designed for applications requiring reliable interconnection between free boards (daughterboards, PCBs) and fixed boards (motherboards, backplanes). It facilitates signal and ground connections, offering flexibility through various module types and configurations, including cable-to-PCB connections. The system is engineered to meet stringent industry standards for performance and reliability.
Product Attributes
- Brand: Z-PACK
- System Type: HM Interconnection System
- Application: Board-to-Board Connections
- Certifications: Complies with IEC917, IEC 61076-4-101, DIN 41626, DIN 43356, IEEE 1301
- Housing Material: UL94V-O rated, glass-filled polyesters
- Signal Contacts: Phosphor bronze (male), Copper alloy (female), gold plated at interface, nickel underplate, tin or tin-lead plated press-fit leads
- Ground Contacts: Phosphor bronze, gold plated at interface, nickel underplate, tin or tin-lead plated press-fit leads
Technical Specifications
| Module Type | Signal Contacts | Length (mm) | Features |
|---|
| Type A | 110 | 50 | MPC, guiding, and polarization |
| Type B | 125 | 50 / 44 / 38 | (No inherent alignment features, requires pairing with modules with alignment features) |
| Type C | 55 | 25 | Guiding and polarization (Extension module) |
| Type A/B | 125 / 110 / 95 | 50 / 44 / 38 | Guide and polarization |
| Specification | Value |
|---|
| PC Board Thickness (Fixed) | 1.4 - 5.6 mm |
| PC Board Thickness (Free) | 1.4 - 4.2 mm |
| PC Board Material Compatibility | Glass-epoxy (NEMA G10, G11, FR 4, FR 5) corresponding to DIN 7735 Hgw-Types or DIN 40802 EP-Types |
| Default Dimension Tolerance | ±0.13 mm |
| Default Angle Tolerance | ±2° |
2411041725_TE-Connectivity-2392865-1_C20506826.pdf