Specifications
Card Connection Mode :
自弹式
Height Above Board :
2mm
Supplementary Features :
带定位柱
Card Detection :
Connector Type :
卡座
Card Type :
MicroSD卡(TF卡)
Description :
Push-Push 2mm Connector and Ejector MicroSD Card (TF Card) SMD PC Card Sockets RoHS
Mfr. Part # :
TFW11-S1F1-2000-A
Package :
SMD
Model Number :
TFW11-S1F1-2000-A
Description

Product Overview

This product specification defines the product performance and test methods for the T-FLASH connector, designed and manufactured by the company. It is a TF card external welding connector.

Product Attributes

  • Brand: SHELL CD PAD
  • Origin: Taiwan Factory: , China Factory:
  • Material: HOUSING: LCP UL94-V0, CONTACT: COPPER ALLOY, SHELL: SUS201
  • Certifications: UL498

Technical Specifications

ItemRequirementsTest Methods
Product ConfirmationProduct shall be conforming to the requirements of applicable product drawing.Visually, dimensions and functionally inspected per applicable product drawing.
Contact resistance (Low Level)80 m Max. initialSubject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max.
Insulation resistance1000 M Min.Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (500 V DC10%).
Dielectric StrengthConnector must withstand test potential of 500 V AC for 1 minute. Current l
Mechanical & Electrical CharacteristicAs described in Table I
MaterialHarmful material can follow the requirement of RoHS.
Electroplating SpecificationsNICKEL UNDERLAYER 40U" MIN, CONTACT AREA GOLD 0.5U"MIN, SOLDER LEG AREA MATTE TIN 80U"MIN.
PlatingCONTACT: GOLD FLASH PLATED. SHELL: NICKEL PLATED.
Electrical CharacteristicsCONTACT CURRENT RATING :O.5A MAX, CONTACT RESISTANCE 100 m MAX, INSULATION RESISTANCE 5OO M MIN
SolderabilityConnectors solderability can meet MIL-STD-202F standard. Finish shall be free of contaminants.
Resistance to Solder Heat (SMT)Preheat: Increase in temperature not to exceed 4 per second. Final preheat temperature will be within 125 of solder temperature. Soldering: Device leads will be exposed to solder wave at 250 for a maximum of 5 seconds. Cool Down: Cool down in ambient air at approximately 20 to 25.
Resistance to Solder Heat (Infrared Reflow)Preheat: Increase in temperature not to exceed 4 per second. Soldering: Maximum allowable time above reflow temperature of 183 is 90 seconds. Maximum temperature in this interval is 260, not to exceed 10 seconds. Cool Down: Cool down shall not exceed 6 per second.Device temperature measurements are referenced from the top-center of the package outer surface.
CleaningAqueous Cleaning: Three cycles; each cycle consisting of a maximum of one minute exposure to 54 to 66 demineralized tap water at a maximum pressure of 30 psi; followed by air drying for 60 to 90 seconds at 93 to 121.
StorageTemperature: -25~+85, Relative humidity: 80%, Not to storage in corrosive environments. A re-qualification test shall be conducted immediately while the storage duration exceed 6 months.
TransportationAny vehicle can be adopted for the transportation, but moisture-proof and no mechanical damage.

2511251735_SHETIME-TFW11-S1F1-2000-A_C52995093.pdf

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TF card external welding connector SHETIME TFW11-S1F1-2000-A with SUS201 shell and UL498 certification

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Card Connection Mode :
自弹式
Height Above Board :
2mm
Supplementary Features :
带定位柱
Card Detection :
Connector Type :
卡座
Card Type :
MicroSD卡(TF卡)
Contact Supplier
TF card external welding connector SHETIME TFW11-S1F1-2000-A with SUS201 shell and UL498 certification

Shenzhen ECER Network Technology Co., Ltd.

Verified Supplier
1 Years
anhui, shenzhen
Since 2009
Business Type :
Manufacturer, Distributor/Wholesaler, Agent, Importer
Total Annual :
10000000-50000000
Employee Number :
300~500
Certification Level :
Verified Supplier
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