The 3M Boardmount Socket 929 Series offers a reliable interconnect solution with a .100" and .100" x .100" pitch. Designed with a tuning fork contact and solder standoffs for efficient wave soldering, these sockets are available in single and double row configurations ranging from 1 to 40 contacts (single row) and 2 to 80 contacts (double row). An optional board retention feature enhances assembly security. These sockets are suitable for applications requiring a current rating of 2 amps maximum and an operating temperature range of -40C to +105C.
| Specification | Value |
|---|---|
| Contact Quantity (Single Row) | 1-40 contacts |
| Contact Quantity (Double Row) | 2-80 contacts |
| Solder Standoffs | Facilitate production wave soldering |
| Optional Feature | Board retention |
| Current Rating | 2 amps maximum (all lines energized at 65C maximum ambient) |
| Insulation Resistance | > 5 109 at 500 VDC |
| Withstanding Voltage | 1,500 VRMS at Sea Level |
| Temperature Rating | -40C to +105C |
| Process Rating | 260C (per J-STD-020C) (PBT Insulator version), Maximum molded insulator temperature 191C (Solder Wave Process Only) |
| Maximum Recommended Mating Header Pin Length | .25 [ 6.4 ] |
| Recommended Mating Headers | 929 series and 2300 series (.100 [ 2.54 ] .100 [ 2.54 ] pin strip) |
| Board Retention Feature | Standard Product (no board retention feature) = 2; With board retention feature = 3 |
| Plating Suffix Options | blank = tin-lead (RIA E3 & C2 apply); RK = matte tin overall; H.T. Nylon Insulator (RIA E1 & C1 apply); 10 = 10 " [0.25 m] gold with tin-lead tails (RIA E3 & C2 apply); 30 = 30 " [0.76 m] gold with tin-lead tails (RIA E3 & C2 apply); RA = 10 " [0.25 m] gold with matte tin tails (RIA E1 & C1 apply); RB = 30 " [0.76 m] gold with matte tin tails (RIA E1 & C1 apply) |
| 1 Row Plating Options | 850 = Gold; 974 = Tin |
| 2 Row Plating Options | 852 = Gold; 975 = Tin |