Specifications
Y-Width of Bottom Edge on Board :
6.5mm
Reference Series :
PanelMate(MX 1.25)
Pins Structure :
1x6P
Contact Plating :
Contact Material :
黄铜;-
Operating Temperature :
-25℃~+85℃
Flame Retardant Rating :
-
Supplementary Features :
辅助焊脚
Pitch :
1.25mm
Voltage Rating (Max) :
125V
Number of PINs Per Row :
6
Number of Rows :
1
X-Length of Bottom Edge on Board (Spacing Line) :
-
Row Spacing :
-
Z-Height of the Board :
1.85mm
Mounting Type :
卧贴
Description :
Connector Header 6 position 1.25mm Pitch 1A Surface Mount, Right Angle
Mfr. Part # :
HDGC1254WR-S-6P
Package :
SMD,P=1.25mm,Surface Mount,Right Angle
Model Number :
HDGC1254WR-S-6P
Description

Product Overview

The HDGC1254WR-S-XP is a wafer product with a 1.25MM pitch and a 90 angle, manufactured by Shenzhen Huade co-create Technology Co., LTD. This product is designed for applications requiring precise connections.

Product Attributes

  • Brand: Huade co-create Technology
  • Origin: Shenzhen, China
  • Part Number: HDGC1254WR-S-XP

Technical Specifications

Specification Value
Pitch 1.25MM
Angle 90
Type Wafer
Tolerances Unless otherwise specified (mm)

2410121336_HDGC-HDGC1254WR-S-6P_C5197189.pdf

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Precision wafer connector HDGC HDGC1254WR-S-6P featuring 1.25MM pitch and 90 angle for electronics

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Y-Width of Bottom Edge on Board :
6.5mm
Reference Series :
PanelMate(MX 1.25)
Pins Structure :
1x6P
Contact Plating :
Contact Material :
黄铜;-
Operating Temperature :
-25℃~+85℃
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Precision wafer connector HDGC HDGC1254WR-S-6P featuring 1.25MM pitch and 90 angle for electronics

Hefei Purple Horn E-Commerce Co., Ltd.

Verified Supplier
1 Years
anhui, hefei
Since 2009
Business Type :
Manufacturer, Distributor/Wholesaler, Agent, Importer
Employee Number :
<300
Certification Level :
Verified Supplier
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