This document details the Foxconn Interconnect Technology Limited AS0A82*-H2SB-7H, a 260-pin SO DIMM connector designed for DDR4 memory modules. It features a standard 5.2mm height and is suitable for SMT processes with a peak temperature of 260C for 10-20 seconds. The connector is built for durability with 60 mating cycles and operates within a temperature range of -55C to +85C. It is constructed with a thermoplastic UL94V-0 housing and copper alloy contacts with various plating options, including gold flash and up to 30" gold plating at the contact area.
| Specification | Value |
|---|---|
| Number of Positions | 260 Pins |
| Connector Type | DDR4 SO DIMM |
| Standard | DDR4 STD |
| Height | 5.2 mm |
| Contact Current Rating | 0.5 Ampere MAX. per pin |
| Voltage Rating | 25V AC |
| Insulation Resistance | 100 Megaohms MIN. at 500V DC |
| Dielectric Withstanding Voltage | 250V AC RMS at 60Hz, for 1 minute |
| Contact Resistance (Initial) | 60 Milliohms MAX. per pin |
| Contact Resistance (After Environmental Testing) | 10 Milliohms MAX. per pin |
| Durability | 60 Mating Cycles |
| Operation Temperature | -55C to +85C |
| SMT Peak Temperature | 260C (10~20 seconds) |
| Overall Width | 72.1 mm |
| Overall Height | 65.7 0.5 mm |
| Slot Width | 70.00 0.15 mm |
| PCB Layout Thickness (Recommended) | 1.40 mm |