Product Description:

IMX577-AACK-C is a diagonal 7.857 mm (Type 1/2.3) 12.3 Mega-pixel CMOS active pixel type stacked image sensor with a square pixel array. It adopts Exmor RST™technology to achieve high speed image capturing by column parallelA/D converter circuits and high sensitivity and low noise image (comparing with conventional CMOS image sensor) through the backside illuminated imaging pixel structure.R.G,and B pigment primary color mosaic filter is employed. It equips an electronic shutter with variable integration time. It operates with three power supply voltages: analog 2.8V, digital 1.05 V and 1.8 V for input/output interface and achieves low power consumption. In addition, this product is designed for use in consumer use camcorder. When using this for another application, Sony Semiconductor Solutions Corporation does not guarantee the quality and reliability of product. Therefore, don't use this for applications other than consumer use camcorder. In addition, individual specification change cannot be supported because this is a standard product.
Consult your Sony Semiconductor Solutions Corporation sales representative if you have any questions.

Features:

• Back-illuminated and stacked CMOS image sensor Exmor RS
  2. Digital Overlap High Dynamic Range(DOL-HDR) mode with raw data output.
  3. High signal to noise ratio (SNR).
  4. Full resolution @60 frame/s (Normal), 4K2K @60 frame/s(Normal), 1080p @240 frame/s
  Full resolution @40 frame/s(12 bit Normal), Full resolution @30 frame/s (DOL-HDR,2frame)
  5. Output video format of RAW12/10/8,COMP8.
  6. Power Save Mode with MIPI ULPS operation
  7. Pixel binning readout and V sub-sampling function.
  8. Independent flipping and mirroring.
  9. Input clock frequency 6 to 27 MHz
  10. CSI-2 serial data output (MIPI 2lane/4lane,Max.2.1Gbps/lane, D-PHY spec. ver.1.2 compliant)
  11. 2-wire serial communication.
  12. Two PLLs for independent clock generation for pixel control and data output interface.
  13. Ambient Light Sensor (ALS)
  14. Fast mode transition.(on the fly)
  15. Dual sensor synchronization operation (Multi camera compatible)
  16. 7K bit of OTP ROM for users.
  17. Built-in temperature sensor
  18. 10-bil/12-bit A/D conversion on chip
  19. Horizontal Low Power analog Cropping
  20. Window Scanning mode
  21. 92-pin high-precision ceramic package

Technical Parameters:

Applications:

Traffic Industrial

3D Imaging

Video Conference

Artificial Intelligence

Live Streaming

Surveillance