TMM13i PCB 2-Layer 15mil with ENIG Finish


The TMM13i PCB is a high-reliability, 2-layer printed circuit board designed using Rogers TMM13i laminate, a ceramic thermoset polymer composite that offers superior electrical and mechanical properties. With a 15mil (0.381mm) substrate thickness, 1oz copper weight, and Immersion Gold (ENIG) surface finish, this PCB is optimized for demanding RF and microwave applications, such as satellite communication systems, RF circuitry, and chip testers.



This PCB meets IPC-Class-2 standards, ensuring exceptional quality and reliability. Its isotropic dielectric constant and low dissipation factor make it ideal for high-frequency operations, while its compatibility with soft substrate processing methods simplifies fabrication.



Key PCB Construction Details

PCB Stackup
The TMM13i PCB features a simple yet highly efficient 2-layer stackup:

• Copper Layer 1: 35μm (1oz) for high-quality signal transmission.
• TMM13i Substrate: 15mil (0.381mm) thickness with a high dielectric constant (Dk=12.85D_k = 12.85Dk​=12.85) for compact and efficient designs.
• Copper Layer 2: 35μm (1oz) for grounding and signal integrity.

Rogers TMM13i Laminate Overview
The Rogers TMM13i laminate is a ceramic thermoset polymer composite specifically developed for high-reliability microwave and RF applications. Its isotropic dielectric constant (Dk=12.85D_k = 12.85Dk​=12.85) and low dissipation factor ensure consistent and reliable electrical performance. The material combines the benefits of ceramic and PTFE substrates while being processed using conventional soft substrate techniques.


Key Features:

• Dielectric Constant (DkD_kDk​): 12.85 ± 0.35
• Dissipation Factor (DF): 0.0019 at 10GHz
• Thermal Coefficient of DkD_kDk​: -70 ppm/°K
• Coefficient of Thermal Expansion (CTE): X-axis: 19 ppm/°C, Y-axis: 19 ppm/°C, Z-axis: 20 ppm/°C
• High Thermal Stability: Operates reliably in a temperature range of -55 to 288°C.
• Lead-Free Process Compatible: Compliant with modern manufacturing standards.
• Fire-Retardant: UL 94 V-0 flammability rating.

The TMM13i laminate also eliminates the need for sodium naphthalene treatment prior to plating, simplifying the manufacturing process while ensuring excellent mechanical durability.


Benefits of TMM13i PCB

High Dielectric Constant for Compact Design: The Dk of 12.85 allows for significant circuit size reduction, making it ideal for compact, high-density designs.

Low Signal Loss: The low dissipation factor (DF = 0.0019) ensures minimal signal attenuation, even at high frequencies.

Reliable Thermal and Mechanical Properties: The material’s CTE closely matches copper, ensuring stable performance during thermal cycling and reducing the risk of delamination or mechanical failure.

Ease of Fabrication: The thermoset resin material does not require specialized treatments, simplifying fabrication while maintaining high-quality results.

Durability in Harsh Environments: The low moisture absorption and resistance to process chemicals enhance the PCB’s reliability in challenging conditions.

Wire-Bonding Compatible: The thermoset resin allows for reliable wire-bonding, making the PCB suitable for advanced applications.


Applications
The TMM13i PCB is tailored for high-frequency and microwave applications, including:
Chip Testers
Dielectric Polarizers and Lenses
Filters and Couplers
RF and Microwave Circuitry
Satellite Communication Systems



Conclusion
The TMM13i PCB 2-Layer 15mil with ENIG Finish is a high-performance circuit board designed for advanced RF and microwave applications. Built on Rogers TMM13i laminate, it offers a combination of high dielectric constant, low dissipation factor, and excellent thermal stability. With a 0.5mm finished thickness, 1oz copper weight, and Immersion Gold surface finish, this PCB delivers outstanding electrical performance, durability, and ease of fabrication. It is the perfect choice for industries such as satellite communications, RF systems, and chip testing, where precision and reliability are critical.