2-Layer TMM13i High-Frequency PCB – 150mil (3.9mm) with OSP Finish

Product Introduction

We present our 2-Layer TMM13i PCB – a high-performance, thick-substrate circuit board engineered for demanding RF and microwave applications requiring a high dielectric constant. Fabricated with Rogers TMM13i isotropic thermoset microwave material and finished with OSP (Organic Solderability Preservative) , this 3.9mm (150mil) board delivers a stable, isotropic Dk of 12.85 ±0.35, ultra-low dissipation factor (Df 0.0019 @ 10 GHz), and exceptional mechanical robustness. The thermoset resin sysatem resists creep and cold flow, withstands harsh process chemicals, and requires no sodium napthanate treatment prior to electroless plating – simplifying fabrication while ensuring reliable plated through-hole (PTH) performance for thick-board designs.

Key Specifications

PCB Stackup (2-Layer Rigid)

Note: No blind vias – all interconnections are through-hole vias. No solder mask or silkscreen ensures minimal signal interference for critical RF paths.

PCB Statistics

Dimensions: 76.8 mm × 97 mm (1 piece)

Components: 29

Total Pads: 47 (19 thru-hole, 28 SMT on top, 0 on bottom)

Vias: 26

Nets: 2

Why TMM13i?

TMM13i is a ceramic-thermoset polymer composite that combines the high-frequency performance of ceramic and PTFE substrates with the processing convenience of soft substrates. Unlike PTFE-based materials, TMM13i is a thermoset resin system that:

Resists creep and cold flow under mechanical stress

Withstands harsh process chemicals without damage

Requires no sodium napthanate treatment prior to electroless plating

Enables reliable wire-bonding for chip-and-wire assemblies

The isotropic dielectric constant (same Dk in all directions) simplifies design for complex 3D electromagnetic structures such as lenses, polarizers, and dielectric resonators.

Key Features of TMM13i

Benefits of This 150mil TMM13i PCB

High & Stable Dk (12.85): Enables significant circuit miniaturization – ideal for dielectric resonators, filters, and compact antennas. ±0.35 tolerance ensures predictable performance.

Ultra-Low Loss: Df of 0.0019 at 10 GHz minimizes signal attenuation for high-sensitivity receivers and low-noise applications.

Isotropic Dk: Same dielectric constant in X, Y, and Z directions – simplifies design for 3D electromagnetic structures like lenses and polarizers.

Copper-Matched CTE: X/Y CTE of 19 ppm/°C closely matches copper, ensuring excellent PTH reliability even in this thick 150mil (3.9mm) board.

Exceptional Z-Axis Stability: Z-direction CTE of only 20 ppm/°C – remarkably low for a 3.9mm thick substrate – minimizes via barrel stress during thermal cycling.

Thermoset Robustness: Resists creep, cold flow, and process chemicals. No sodium napthanate treatment required – simplifies plating and reduces fabrication costs.

OSP Finish: Provides a flat, copper-preserving surface for SMT assembly (28 top pads). Ideal for applications requiring minimal surface finish interference with RF performance.

Wire-Bond Ready: Thermoset resin enables reliable gold wire bonding for chip-on-board (COB) assemblies.

Quality Assurance

100% electrical testing prior to shipment

IPC-Class-2 compliance

Full Gerber RS-274-X acceptance

ISO 9001 certified production

Typical Applications

Chip Testers & RF Socket Interfaces (high Dk for controlled impedance)

Dielectric Polarizers & Lenses (isotropic Dk enables uniform phase response)

Filters & Couplers (high Dk miniaturizes resonant structures)

RF & Microwave Circuitry (strip-line, micro-strip, and grounded coplanar waveguide)

Satellite Communication Systems (low loss, high stability, low out-gassing)

Dielectric Resonator Oscillators (DROs)

Patch Antennas (high Dk reduces footprint)

Ordering Information

Submit your Gerber RS-274-X files and fabrication drawings. We support prototype to volume production with global shipping.

Contact us for:

Impedance control reports

Dk/Df verification test data

PTH reliability test reports (thermal shock, solder float)

Volume pricing and lead times