2-Layer RO4725JXR PCB: 0.8mm Thick, 30.7mil Core, and ENIG Finish for Antenna Applications

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

Overview of the 2-Layer RO4725JXR PCB

The 2-layer RO4725JXR PCB is a cost-effective, high-performance printed circuit board designed specifically for antenna-grade applications. Manufactured using Rogers RO4725JXR hydrocarbon/ceramic laminate, this PCB offers low dielectric loss, consistent circuit performance, and reduced passive intermodulation (PIM). With a finished thickness of 0.8mm, immersion gold surface finish, and rigid structure, this PCB is optimized for cellular base station antennas and other demanding RF systems.

Fully compatible with standard FR-4 processes, the RO4725JXR PCB eliminates the need for specialized handling, making it an affordable alternative to PTFE-based laminates without compromising performance.

PCB Construction Details

The 2-layer rigid PCB is engineered with precision to ensure durability and superior signal performance. Below are the construction details:

PCB Stackup

This straightforward stackup design ensures low insertion loss and stable signal propagation, making it ideal for RF applications.

PCB Statistics

The 2-layer RO4725JXR PCB is designed to meet the needs of simple but effective component layouts. Below are its key statistics:

• Components: 6
• Total Pads: 39
• Thru Hole Pads: 31
• Top SMT Pads: 8
• Bottom SMT Pads: 0
• Vias: 20
• Nets: 2

Introduction to RO4725JXR Material

Rogers RO4725JXR laminates are a hydrocarbon/ceramic composite reinforced with woven glass, designed to provide antenna-grade performance at a lower cost compared to PTFE-based laminates. The material’s low dielectric constant (Dk) and low loss tangent (Df) ensure minimal signal loss and consistent electrical performance.

RO4725JXR materials are fully compatible with FR-4 processes, eliminating the need for special handling or through-hole preparation. Additionally, the material’s low passive intermodulation (PIM) performance ensures superior signal quality in cellular base station antennas.

Features of RO4725JXR

• Dielectric Constant (Dk): 2.55 ± 0.05 at 10GHz/23°C
• Dissipation Factor (Df):
• 0.0026 at 10GHz/23°C
• 0.0022 at 2.5GHz
• Thermal Coefficient of Dielectric Constant (TCDk): +34 ppm/°C
• CTE (Coefficient of Thermal Expansion):
• X-axis: 13.9 ppm/°C
• Y-axis: 19 ppm/°C
• Z-axis: 25.6 ppm/°C
• High Tg Value: >280°C
• Low PIM Performance: -166 dBc (43dBm, 1,900MHz signal)

Benefits of RO4725JXR PCB

Low Dielectric Loss: Ensures minimal signal attenuation for high-frequency applications.

Consistent Circuit Performance: Dk and Df values are stable across wide frequency ranges.

Low Passive Intermodulation (PIM): Improves signal quality in antenna systems.

Cost-Effective Alternative: Matches PTFE-based materials in performance without the high cost.

Thermal Stability: High Tg and CTE matched to copper enhance durability during operation.

Applications of RO4725JXR PCB

Cellular Base Station Antennas: Delivers reliable signal performance and low PIM.

Point-to-Point Communication Systems: Supports low-loss and high-gain applications.

Microwave and RF Systems: Ensures consistent performance for high-frequency circuits.

Satellite Communication Systems: Provides thermal and electrical stability in demanding environments.

Why Choose the 2-Layer RO4725JXR PCB?

The 2-layer RO4725JXR PCB combines optimal performance, cost efficiency, and easy manufacturability, making it an excellent choice for antenna-related applications. With its low dielectric constant, low dissipation factor, and superior thermal properties, this PCB ensures long-lasting performance in high-frequency environments.

Contact us today to learn more about this high-performance PCB or to discuss your project requirements!