Specifications
Brand Name :
Bicheng Enterprise Limited
Model Number :
BIC-0818-V8.18
Certification :
UL
Place of Origin :
China
MOQ :
1
Price :
USD78~110
Payment Terms :
T/T , Paypal
Supply Ability :
45000 pieces per month
Delivery Time :
2-3 working days
Packaging Details :
KK carton (hard card)
Base material :
Stainless steel shim
Structure :
Stencil foils with aluminum frame
Foil Thickness :
0.12mm
Aperture configured :
Laser cut
Appearance :
Engraving and electro polishing
Fiducial mark :
Through hole
Application: :
CSP, BGA, 0.5mm QFP etc. package
Description

Product profile

1.1 General description


This is a type of laser cut SMT stencil built on 0.12mm stainless steel foil with 598 mm

x 598 mm length and width. It’s fabricated per IPC 7525A using supplied Gerber data,

squeegee area locating in the center. 4 sides of edges are through holes to suit for the

SMT machine. It’s packed with KK carton (hard card) and usually 2 stencils are packed

for shipment.

1.2 Features and benifits


A. The data file is used directly to produce and reduce the error rate;
B. The opening position accuracy of SMT template is very high: the whole process error

is ≤ ±4 μ m;
C. The opening of SMT template has geometric figure, which is advantageous to the

printing and forming of tin paste;
D. ISO9000 certified manufacturing factory;
E. 12 hours quotation;
F. Quick Lead time: 1-2 days;
G. No MOQ, low cost for prototypes and small runs quantity;

1.3 Application


SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip.

1.4 Parameter and data sheet

Dimension: 598 x 598 mm =1 PCS
Structure Stencil foils with aluminum frame
Base material Stainless steel shim
Foil Thickness 0.12mm
Aperture configured Laser cut
Appearance Engraving and electro polishing
Fiducial mark Through hole
Service area: Worldwide
Quantity of open pads: 166
Advantages:

a) High precision dimension; b) Good shape on the window;

c) Hole wall is smoother.

Application: CSP, BGA, 0.5mm QFP etc. package

1.5 Opening Hole Design for Stencil

Component Type Pitch Soldering Width Soldering Length Opening Width Opening Length Shim Thickness
PLCC 1.27mm 0.65mm 2.00mm 0.60mm 1.95mm 0.15-0.25mm
QFP 0.635mm 0.35mm 1.50mm 0.32mm 1.45mm 0.15-0.18mm
QFP 0.50mm 0.254-0.33mm 1.25mm 0.22-0.25mm 1.20mm 0.12-0.15mm
QFP 0.40mm 0.25mm 1.25mm 0.20mm 1.20mm 0.10-0.12mm
QFP 0.30mm 0.20mm 1.00mm 0.15mm 0.95mm 0.07-0.12mm
0402 0.50mm 0.65mm 0.45mm 0.60mm 0.12-0.15mm
0201 0.25mm 0.40mm 0.23mm 0.35mm 0.07-0.12mm
BGA 1.27mm 0.80mm 0.75mm 0.75mm 0.15-0.20mm
BGA 1.00mm 0.38mm 0.35mm 0.35mm 0.10-0.12mm
BGA 0.50mm 0.30mm 0.28mm 0.28mm 0.07-0.12mm
Flip Chip 0.25mm 0.12mm 0.12mm 0.12mm 0.12mm 0.08-0.10mm
Flip Chip 0.20mm 0.10mm 0.10mm 0.10mm 0.10mm 0.05-0.10mm

598 x 598 mm Laser Stencil Built on 0.12mm Stainless Steel Foil for SMT usage.

598 x 598 mm Laser Stencil Built on 0.12mm Stainless Steel Foil for SMT usage.

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598 x 598 mm Laser Stencil Built on 0.12mm Stainless Steel Foil for SMT usage.

Ask Latest Price
Brand Name :
Bicheng Enterprise Limited
Model Number :
BIC-0818-V8.18
Certification :
UL
Place of Origin :
China
MOQ :
1
Price :
USD78~110
Contact Supplier
598 x 598 mm Laser Stencil Built on 0.12mm Stainless Steel Foil for SMT usage.
598 x 598 mm Laser Stencil Built on 0.12mm Stainless Steel Foil for SMT usage.
598 x 598 mm Laser Stencil Built on 0.12mm Stainless Steel Foil for SMT usage.
598 x 598 mm Laser Stencil Built on 0.12mm Stainless Steel Foil for SMT usage.
598 x 598 mm Laser Stencil Built on 0.12mm Stainless Steel Foil for SMT usage.
598 x 598 mm Laser Stencil Built on 0.12mm Stainless Steel Foil for SMT usage.
598 x 598 mm Laser Stencil Built on 0.12mm Stainless Steel Foil for SMT usage.
598 x 598 mm Laser Stencil Built on 0.12mm Stainless Steel Foil for SMT usage.

Shenzhen Bicheng Electronics Technology Co., Ltd

Site Member
9 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Site Member
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