Carbon Fiber Surface Mat: Next-Gen Reinforcement For Extreme Environments
Attribute | Value |
Fiber Diameter | 6-7μm |
Surface Resistivity | <10Ω |
Thermal Conductivity | <0.08 W/m·K |
Resin Wet-Out Time | <25 sec |
Processing Temperature | 2500(℃) |
Length | 1m--6m |
Product Introduction & Features
Carbon Fiber Surface Mat represents a revolutionary advancement in composite materials, combining ultra-high surface conductivity with unprecedented thermal resilience. Engineered through a proprietary 3D fiber alignment process, this material features a gradient-density structure of short carbon fibers (1-50 μm) embedded in a phenolic-polyimide hybrid matrix.
Key Innovations
- Thermal Shock Resistance: Withstands thermal cycling from -196°C (liquid nitrogen) to 300°C without delamination.
- Adaptive Conductivity: Conductivity tunable via fiber volume fraction (15-40%), enabling EMI shielding or static dissipation.
- Hybrid Matrix System: Phenolic resin provides fire resistance (UL94 V-0), while polyimide enhances chemical inertness.
- Eco-Conscious Production: 30% bio-based resin content meets circular economy standards (compliant with ISO 14021).
Manufacturing Process
Stage | Technological Breakthrough |
Electrospinning | Carbon nanofibers (500 nm diameter) collected on rotating mandrels for uniform mat formation. |
Plasma Activation | Surface functionalization via plasma treatment (O₂/CF₄) enhances resin wettability by 40%. |
Hybrid Curing | Dual-stage curing: 120°C phenolic crosslinking + 200°C polyimide curing for dimensional stability. |
Laser Micromachining | Precision cutting (±5 μm accuracy) for complex geometries in aerospace components. |
Smart Quality Control | AI-powered vision systems detect fiber misalignment <0.1% in real time. |
Usage Precautions
- Environmental Storage: Maintain <15% RH with inert gas purging to prevent oxidation.
- Processing Temperature: Critical window: 180-220°C for phenolic curing; avoid >250°C to prevent matrix degradation.
- Electrical Safety: Grounding required during handling due to static-prone nature.
- Chemical Compatibility: Compatible with epoxy, PEEK, and fluoropolymers; incompatible with amines or chlorinated solvents.
- Disposal Protocol: Recyclable via pyrolysis (recover 90% carbon content).
Key Specifications
Parameter | Grade A (High Conductivity) | Grade B (Fire Retardant) |
Electrical Conductivity | 50-100 S/m | 1-10 S/m |
Thermal Conductivity | 25 W/m*K | 1.2 W/m*K |
Char Yield | 60% (@700°C) | 85% (@700°C) |
Mechanical Strength | 450 MPa (tensile) | 320 MPa (tensile) |
Moisture Absorption | <0.5% (24h/25°C) | <0.1% (24h/25°C) |
Certifications | NASA-STD-6012, MIL-I-24768 | IEC 60695-11-10, UL 94 V-0 |
Applications
- Aerospace: Hypersonic vehicle leading edges, reusable rocket nozzle liners requiring thermal/chemical resilience.
- Energy Systems: Hydrogen storage tanks, electrolyzer bipolar plates with integrated conductivity.
- Electronics: 5G base station radomes, flexible printed circuit boards for wearable tech.
- Defense: Electromagnetic warfare countermeasures, blast-resistant vehicle armor.
- Industrial: Plasma reactor liners, semiconductor wafer carriers with ultra-low particulation.