Specifications
Brand Name :
HY
Model Number :
HY-DHGJP
Certification :
CE
Place of Origin :
China Yixing
MOQ :
10 pieces
Price :
Negotiation
Payment Terms :
L/C, D/P, T/T, Western Union
Supply Ability :
10000 pcs per weeks
Delivery Time :
20-30 working days
Packaging Details :
wooden case
characteristic :
oil-free self-lubricating
product name :
Silicon nitride ceramic basic chip
color :
black
bending strength :
>600Mpa
hardness/HV10 :
1600
thermal conductivity :
>60W/m.k
dielectric constant :
7.8
Description

silicon nitride ceramics basic chip integrated electronic circuit military technology electric automobile

product name:Silicon nitride ceramic basic chip

product description:

Silicon nitride ceramic substrate is a ceramic substrate with silicon nitride ( SI3N4 ) as the main crystal phase, also known as silicon nitride ceramic substrate. The molecular formula of silicon nitride is SI3N4, the relative molecular mass is 140.28, the hexagonal crystal system, and the crystal is hexahedron. Silicon nitride ceramic is a kind of high temperature heat-resistant material. Its thermal conductivity is more than 5 times higher than that of alumina ceramic, and its expansion coefficient is low, which is consistent with the performance of silicon. The substrate made of silicon nitride ceramics as the main raw material has excellent characteristics such as high thermal conductivity, low expansion coefficient, high strength, corrosion resistance, excellent electrical properties, and good light transmission. It is an ideal heat dissipation substrate and packaging material for large-scale integrated circuits. At the same time, silicon nitride also has excellent mechanical properties and machinability, high temperature resistant ceramics, corrosion resistant ceramics, wear-resistant ceramics, diamagnetic ceramics, insulating ceramics and self-lubricating ceramics.

product index:

characteristic specification detecting instrument

material properties

Microscopic density ≥3.22g/cm3 GB/T1033
bending strength >600MPa ASTM C1161-2013
young's modulus >310GPa ASTM C1259-2014
vickers hardness >15GPa ASTM C1327-2015
fracture toughness 6.5MPa/√m ASTM C1421
thermal conductivity >60W/m.k 25℃,ASTM D5470

thermal expansion coefficient

2.6*10-6/k 40-400℃,ASTM D696
2.6*10-6/k 40-800℃,ASTM 696

electrical properties

dielectric constant 7.8 1MHz,ASTM D2419
dielectric loss 4*10-4 1MHz,ASTM D2419
volume resistivity >1014Ω 25℃,ASTM D2739
breakdown voltage >15KV/mm ASTM D149

Send your message to this supplier
Send Now

Black Silicon Nitride Industrial Ceramic Parts Integrated Electronic Circuit Military Technology

Ask Latest Price
Brand Name :
HY
Model Number :
HY-DHGJP
Certification :
CE
Place of Origin :
China Yixing
MOQ :
10 pieces
Price :
Negotiation
Contact Supplier
Black Silicon Nitride Industrial Ceramic Parts Integrated Electronic Circuit Military Technology
Black Silicon Nitride Industrial Ceramic Parts Integrated Electronic Circuit Military Technology
Black Silicon Nitride Industrial Ceramic Parts Integrated Electronic Circuit Military Technology
Black Silicon Nitride Industrial Ceramic Parts Integrated Electronic Circuit Military Technology
Black Silicon Nitride Industrial Ceramic Parts Integrated Electronic Circuit Military Technology
Black Silicon Nitride Industrial Ceramic Parts Integrated Electronic Circuit Military Technology

yixing haiyu refractory co.,ltd

Active Member
3 Years
Since 2005
Business Type :
Manufacturer
Total Annual :
300 million-500 million
Employee Number :
50~100
Certification Level :
Active Member
Contact Supplier
Submit Requirement