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FPC Flexible PCB Cushion Pad Reusable High Temperature Resistant Hot Press Lamination Buffer Mat for Flexible Circuit Board Manufacturing
FPC Flexible PCB Cushion Pad Reusable High Temperature Resistant Hot Press Lamination Buffer Mat for Flexible Circuit Board Manufacturing
FPC Flexible PCB Cushion Pad Reusable High Temperature Resistant Hot Press Lamination Buffer Mat for Flexible Circuit Board Manufacturing
FPC Flexible PCB Cushion Pad Reusable High Temperature Resistant Hot Press Lamination Buffer Mat for Flexible Circuit Board Manufacturing
Specifications
Model Number :
MKCP-FPC-G3
Surface Feature :
Ultra smooth surface, optional matte or glossy surface
MOQ :
50pcs
Character :
High temperature up to 250 °C
Place of Origin :
China
Usage :
good buffer resilience and avoids the scratch
Price :
Negotiable
Packaging Details :
Strong plywood package with proper soft protection material inside, suitable for long distance for sea or air transport
Product Name :
CCL Cushion Pad
Supply Ability :
10000 Square Meters per Month
Payment Terms :
L/C, D/A, D/P, T/T, Western Union
Material :
FPC Flexible PCB Cushion Pad
Delivery Time :
10-20 working days
Brand Name :
MK
Service Lifespan :
Supports 100-200repeated hot pressing cycles,
Description
FPC Flexible PCB Cushion Pad Reusable High Temperature Resistant Hot Press Lamination Buffer Mat for Flexible Circuit Board Manufacturing
Reusable High Temperature Resistant Hot Press Lamination Buffer Mat for Flexible Circuit Board Manufacturing
Product Introduction
FPC (Flexible Printed Circuit) technology offers high flexibility, lightweight construction, and easy integration, making it ideal for compact and portable electronic devices. Our ESCP-FPC-G3 cushion pad is specifically engineered for FPC and rigid-flex PCB hot lamination processes, delivering stable buffering, uniform heat conduction, and consistent pressing performance to significantly enhance lamination yield and production efficiency.
This premium reusable buffer mat serves as an advanced replacement for traditional multi-layer hot press kraft paper, perfectly fitting automated PCB lamination lines while reducing overall material costs by over 20%. Also known as FPC lamination press pad, hot press cushion mat, and PCB buffering pad, it is an essential consumable for precision FPC manufacturing.
Product Features
  • Reusable for 100-200 lamination cycles, significantly reducing flexible PCB production costs
  • Superior performance in flatness, wear resistance, dimensional stability, and thickness consistency, far exceeding traditional hot press kraft paper
  • Excellent high temperature resistance, operating continuously at up to 260°C without carbonization or brittleness
  • Outstanding buffering effect and thermal conductivity with stable compression and expansion coefficients, plus excellent tear resistance
  • Flame retardant, non-toxic, odorless, dust-free, shaving-free, and featuring good breathability
Technical Specifications
Service Life 100-200 cycles
High Temperature Resistance ≤260°C
Thickness 1.5-2.0mm
Thickness Tolerance ±0.3mm
Size Tolerance (Length/Width) ±2mm
Tensile Strength ≥ 25 MPa
Buffer Standard ≥ 12%
Water Absorption Standard < 8% (3-8%)
Product Highlights & Core Features
Performance Item Detailed Features & Benefits
Reusable Service Life Supports 100-200 repeated hot lamination cycles, greatly reducing material replacement and production costs
Premium Physical Properties Superior flatness, wear resistance and dimensional stability with low expansion ratio and minimal thickness variation, far exceeding traditional hot press kraft paper
High Temperature Resistance Works stably under continuous high temperature up to 260°C without carbonization, brittleness or performance attenuation
Stable Buffering & Thermal Conductivity Uniform heat conduction, stable compression and expansion coefficient, and excellent tear resistance, ensuring consistent lamination quality
Safe & Clean Performance Flame-retardant, non-toxic, odorless, dust-free and shaving-free with good air permeability, meeting industrial precision production standards
FPC Flexible PCB Cushion Pad Reusable High Temperature Resistant Hot Press Lamination Buffer Mat for Flexible Circuit Board Manufacturing FPC Flexible PCB Cushion Pad Reusable High Temperature Resistant Hot Press Lamination Buffer Mat for Flexible Circuit Board Manufacturing
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FPC Flexible PCB Cushion Pad Reusable High Temperature Resistant Hot Press Lamination Buffer Mat for Flexible Circuit Board Manufacturing

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Product Detail
Model Number :
MKCP-FPC-G3
Surface Feature :
Ultra smooth surface, optional matte or glossy surface
MOQ :
50pcs
Character :
High temperature up to 250 °C
Place of Origin :
China
Usage :
good buffer resilience and avoids the scratch
Contact Supplier
FPC Flexible PCB Cushion Pad Reusable High Temperature Resistant Hot Press Lamination Buffer Mat for Flexible Circuit Board Manufacturing
FPC Flexible PCB Cushion Pad Reusable High Temperature Resistant Hot Press Lamination Buffer Mat for Flexible Circuit Board Manufacturing

MKarte Material Technology (Tianjin) Limited

Verified Supplier
7 Years
tianjin, tianjin
Since 2016
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Main Products :
Smart Card Material, PVC Card Material, Inkjet Printable PVC Sheets
Total Annual :
5 million-10 million
Employee Number :
50~100
Certification Level :
Verified Supplier
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