0.54 MP MONO Global Shutter 68 Perspective MIPI Camera Module With VD55H1 Sensor

1. Basic Parameters:

‑ Resolution: 672(H)×804(V), 0.54MP. It enables high‑density 3D depth point acquisition with rich imaging details and high‑fidelity spatial reconstruction.

‑ Pixel Size: 4.6μm(H)×4.6μm. Adopting CDTI charge‑domain pixel architecture combined with back‑illuminated design, it balances photosensitivity and imaging stability and effectively reduces imaging noise.

‑ Optical Format: 1/4‑inch. Compact in size, it is suitable for integration design of various miniature modules.

‑ Supply Voltage: Core voltage 1.1V, interface voltage 1.8V, analog voltage 2.8V. It can operate stably under various voltage conditions to ensure sensor reliability.

‑ Temperature Range: Operating temperature ranges from ‑30℃ to 85℃. Its wide operating temperature range allows adaptation to diverse working environments.

2. Technical Features:

‑ Global Shutter Technology: The global shutter design effectively eliminates motion blur and illumination artifacts while lowering power consumption for illumination.

‑ It adopts 65‑nm stacked Back‑Side Illuminated (BSI) wafer process and is equipped with a dedicated 940 nm infrared photosensitive system. Its demodulation contrast reaches over 85%, delivering excellent resistance to ambient light interference. It can output high‑definition and clean depth images under complex low‑light and high‑light conditions.

‑ Supporting high‑frequency modulation at 200 MHz, it achieves greatly reduced depth noise compared with conventional hundred‑megahertz ToF sensors. Typical ranging distance reaches 5 m under full‑resolution mode, and the ranging distance can be further extended under patterned illumination conditions, featuring high ranging accuracy and wide detection range.

‑ VD55H1 MONO Camera Module: Compatible with standard modules with different lens configurations such as 68° to meet diverse customer requirements.

3. Application Fields:

It is applied in virtual reality / augmented reality, biometric recognition, drones, smart home, IoT devices, 3D imaging, machine vision, barcode scanning, factory automation and other fields.

4. Customization Services:

Custom modules can be produced according to customer requirements to deliver tailor‑made products matching customers’ needs.