Independent 3 heating zones Manual BGA Rework Station WDS-520
 
Product Description
 
	- Our BGA Rework Station/BGA reballing station are widely used to replace and repair the BGA chip in laptop , mobile phone , xbox 360, ps3,etc.
 
	- The main user is repairing shops and factory to provide the after-sales service and rework.
 
 
Manual BGA Rework Station
Model:WDS-520
	- Repair Success Rate:More Than 99%
 
	- Using The Industriak Touche Screen
 
	- Independent 3 Heating Zones, Hot Air Heating/ Infrared Preheat.(temperature accuracy ± 2°C)
 
	- With CE Certification
 
Main Features
Operation System
	- Manual mode.
 
	- Can solder, desolder, mount, pick and replace chip.
 
	- User-friendly.
 
Strict Temperature Control System
 
	- 8 segments rising temperature/constant time/ temperature rising slope, it can save hundreds of groups temperature curve.
 
	- It adopts high accuracy K-type thermocouple close-loop control.
 
	- The external sensor can detect temperature precisely, analyze and calibrate the real temperature curve accurately at any time.
 
Safety Sustem
	- With CE cetification
 
	- With automatic power-off protection device when abnormal accident happens and double over-temp protection fuction.
 
	
		
			| Power supply | 
			AC 220V ± 10% 50Hz | 
		
		
			| Total power | 
			3800W | 
		
		
			| Heater power | 
			Upper temp.zone 800W, second temp.zone 1200W, IR temp.zone 1800W(1200W controlled) | 
		
		
			| Electrical material | 
			Touch screen+Temperature control module+ microcontrollers | 
		
		
			| Locating way | 
			V-shape card slot + Universal jigs | 
		
		
			| PCB size | 
			Max 300mm*280mm Min 10mm*10mm | 
		
		
			| Applicable chips | 
			Max 60mm*60mm Min 1mm*1mm | 
		
		
			| PCB thickness | 
			0 .3-5mm | 
		
		
			| Overall dimension | 
			L460mm*W480mm*H500mm | 
		
		
			| Weight of machine | 
			About 30KG | 
		
		
			| Usage | 
			Repair chips/phone motherboard etc. |