WDS-880D Main Features:

1. Hot air head and mounting head integrated design, with automatic mounting automatic welding and automatic dismantling function;
2. The upper air head adopts the hot air system, quick heating, uniform temperature, fast cooling (cooling can drop 50-80 degrees), to better meet the requirements of lead-free soldering process.Lead-free soldering process requirements. Lower hot temperature area are used infrared + hot air hybrid heating, infrared directly on the heating area, and hot air conduction at the same time, which can make up for each other's shortcomings, so that the PCB warming up fast (warming rate of 10 ℃ / S), while the temperature is still maintained at an even temperature;

1. Independent three temperature zones (upper temperature zone, lower temperature zone, infrared preheating zone), the upper temperature zone and the lower temperature zone to achieve synchronized automatic movement, can automatically reach the bottom of the infrared preheating zone in any position. The lower temperature zone can move up and down to support the PCB, which is automatically controlled by motor. Realize the PCB in the fixture does not move, the upper and lower heating head can move to the PCB target chip;
2. PCB board adopts high-precision slider to ensure the placement accuracy of BGA and PCB board.
3. Original bottom preheating platform, using excellent heating materials imported from Germany (infrared gold-plated light tube) + anti-glare thermostatic glass (temperature resistance up to 1800 ℃) preheating area of 500 * 420mm; the preheating area of 500 * 420mm. 1800℃) preheating area of 500*420mm.
4. The preheating platform, clamping device and cooling system can be moved in X direction. It makes PCB positioning and soldering safer and more convenient.
5. X,Y adopts motor automatic control of the movement mode, so that the alignment is fast and convenient, the equipment space is fully utilized to achieve a relatively small equipment volume of ultra-large area PCB rework, the maximum size of the clamping plate can be up to 590 * 400mm, no rework dead ends;
6. Dual joystick control, alignment lens and upper and lower heating platform to ensure alignment accuracy;
7. Built-in vacuum pump, φ angle rotation, precision fine-tuning mounting nozzle;
8. The suction nozzle automatically recognizes the suction and mounting height, and the pressure can be controlled within a tiny range of 10 grams, with 0 pressure suction and mounting functions for smaller chips;
9. Color optical vision system with manual X, Y direction movement, with spectral dual-color, magnification and fine-tuning functions, including chromatic aberration resolution device, auto-focus, software operation, can be returned to repair the largest BGA size 80 * 80 mm;
10. Various sizes of alloy hot air nozzles, easy to replace, can be rotated 360 ° positioning;
11. Configuration of 4 temperature measurement ports, with multi-point real-time temperature monitoring and analysis;
12. With solid-state operation display function, so that the temperature control is more safe and reliable;
13. The machine can automatically generate SMT standard temperature disassembly curve under the temperature of different environments in different regions, without the need to manually set the curve of the machine, with or without the experience of the operator can be used to realize the intelligence of the machine;
14. With a camera to observe the melting point of the side of the tin ball, easy to determine the curve (this function is optional).