Application Fields
Circulating hot air heating is used for reflow soldering in the micro-assembly processes of mounted components, modules, chips, and power devices.
Main Features
- Utilizes circulating hot air heating in air or protective atmosphere, ensuring thorough heating, high efficiency, and compliance with current high-density SMT soldering requirements.
- Uniform furnace temperature, sufficient binder removal, and convenient and reliable operation.
Optional Systems
- Industrial integrated control system
- Ultrasonic online cleaning system
- OMEGA flexible temperature profiling system
- Exhaust gas treatment system